Vehicle Power Module Cooling Channel for Double-Sided Heat Dissipation
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Solution Overview
Problem
Double-sided cooling power modules for electric vehicles face inefficiencies in heat dissipation and manufacturing due to conventional cooling designs, which result in low cooling efficiency and complex processes.
Innovation Solution
A power module design featuring a cooling channel directly bonded to the circuit board and coupled to a cooler, with an insulator surrounding the circuit board and semiconductor chip, and a copper clip for improved electrical conductivity, along with a symmetric double-sided cooling structure to enhance heat dissipation and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional cooling design is used in double-sided cooling power modules, then the structure is simpler to manufacture, but the cooling efficiency is low
Solution Approach 1:
The patent merges the cooling channel with the circuit board by directly bonding them together, eliminating the need for separate cooling plates and complex assembly processes. This integration achieves both high cooling efficiency through direct thermal contact and manufacturing simplicity by reducing the number of components and assembly steps.
Solution Approach 2:
The circuit board is designed to serve dual functions: electrical connection and heat dissipation. By integrating the cooling channel directly into the circuit board structure, the board simultaneously performs its electrical function and acts as a heat dissipation component, eliminating the need for separate dedicated cooling structures.
2Reliability
If high strength and high heat dissipation characteristics are achieved, then the power module can handle high voltage and vibration, but the device complexity increases
Solution Approach 1:
The patent combines multiple functions into integrated structures: the cooling channel is merged with the circuit board, and the insulator is merged with the cooler assembly. This reduces the number of separate components while maintaining high strength and heat dissipation performance, thereby reducing overall device complexity.
Solution Approach 2:
The patent employs composite material structures, such as the insulator made of epoxy resin combining electrical insulation with thermal management properties, and the cooler assembly integrating multiple functional layers. These composite structures achieve high reliability without requiring numerous separate components.
3Ease of manufacture
If multiple separate components are used for cooling and insulation, then the manufacturing process is more flexible, but the manufacturing complexity and time increase
Solution Approach 1:
The patent integrates the cooling channel with the circuit board and the insulator with the cooler assembly, reducing the number of separate components that need to be manufactured and assembled. This integration significantly reduces manufacturing complexity and assembly time while maintaining process flexibility through modular design of the integrated units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly increases cooling efficiency and electrical performance by direct heat dissipation and reduced manufacturing complexity, while ensuring durability against high thermal stress.
Implementation Method 1
a first cooling channel coupled to a second side of the first circuit board and inserted in and jointed to a first coolant flow channel of a first cooler
Implementation Method 2
an insulator surrounding outer sides of the first circuit board and the first semiconductor chip and a lateral side of the first cooling channel
Implementation Method 3
inserted in and jointed to a first coolant flow channel of a first cooler
Data Source
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AI summary
A power module for a vehicle includes: a circuit board including a circuit pattern; a semiconductor chip connected to a first side of the circuit board; a lead frame disposed on the circuit board as being spaced apart from the semiconductor chip, and electrically connected to the semiconductor chip; and a cooling channel coupled to a second side of the circuit board and inserted in and jointed to a coolant flow channel of a cooler.