Power Module Cooling via Heat Sink Cover Clamping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power module cooling systems require significant installation space and compromise on thermal and mechanical design due to screw connections, leading to inefficiencies in heat dissipation and increased manufacturing costs.
Innovation Solution
A power module cooling arrangement that eliminates direct screw connections by using a heat sink cover to clamp the heat sink in place, allowing for material bonding and interlocking designs that enhance heat dissipation without additional space requirements, and incorporates air flow channels for improved cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screw connections are used to attach the heat sink to the housing and power units, then mechanical strength and reliability are improved, but thermal performance deteriorates due to thermal resistance at connection points and additional space requirements
Solution Approach 1:
The patent introduces a heat sink cover as an intermediary component that mechanically connects the heat sink to the housing without requiring direct screw connections through the heat sink body. The cover acts as a mediator that provides mounting holes and connection points, allowing the heat sink to maintain its thermal integrity while achieving reliable mechanical attachment through the cover structure.
2Strength
If threaded holes with sufficient threads are created for screw connections, then connection strength is improved, but heat sink root thickness must be increased, reducing thermal performance
Solution Approach 1:
The patent segments the mounting function from the heat dissipation function by creating a separate heat sink cover structure. The cover contains all threaded holes and mounting features, while the heat sink root remains thin and optimized for thermal performance. This segmentation allows the heat sink body to focus solely on heat dissipation without compromising mechanical strength.
3Ease of operation
If mounting holes and tabs are added to the heat sink for attachment, then ease of installation is improved, but device complexity increases and manufacturing costs rise
Solution Approach 1:
The patent merges the mounting function into a separate heat sink cover component that is attached to the heat sink. This combining approach allows the heat sink itself to remain simple and optimized for thermal performance, while the cover integrates all mounting holes, tabs, and connection features. The merged structure provides ease of installation without increasing the complexity of the heat dissipation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces installation space, enhances heat dissipation, minimizes manufacturing costs, and simplifies installation while maintaining effective thermal performance, allowing for more compact and efficient power module designs.
Implementation Method 1
at least one heat sink (NKK)
Implementation Method 2
incorporates air flow channels for improved cooling performance
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The invention relates to an arrangement for cooling a power module with at least one power unit (LE) in a housing having at least one heat sink (NKK), in which the arrangement for cooling has at least one heat sink cover (NKKA), and at least one part of the power module, more particularly the housing, at least one part of the heat sink (NKK) and/or at least one part of the heat sink cover (NKKA) is designed such that, after the heat sink cover (NKKA) has been attached, the heat sink (NKK) is fixed in the housing, more particularly by means of clamping, as a result of the interaction between the embodiment of heat sink (NKK), heat sink cover (NKKA) and/or housing. The invention also relates to a power module having such an arrangement for cooling the power module.