Power Module Cooling Structure for Uniform Coolant Flow
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Solution Overview
Problem
Conventional power modules in electric vehicles and hybrid electric vehicles face inefficiencies in cooling, leading to overheating and degradation due to inadequate heat dissipation, particularly in semiconductor devices like IGBTs and SiC MOSFETs.
Innovation Solution
A power module apparatus with a heat radiator attached to the upper surface of a cooling device, featuring a coolant passage system where the heat radiator is aligned to minimize interference with coolant flow, ensuring uniform cooling and reducing overheating degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is disposed on the back side surface of the leadframe to cool the semiconductor device, then heat dissipation is improved, but the cooling efficiency is insufficient leading to overheating and degradation
Solution Approach 1:
The patent transitions from conventional single-side cooling (back side surface only) to dual-side cooling by adding a heat radiator to the front surface of the leadframe. This dimensional expansion of the cooling system allows heat to be dissipated from both surfaces of the leadframe simultaneously, significantly improving cooling efficiency and preventing overheating of the semiconductor device.
Solution Approach 2:
The patent combines the heat sink on the back side surface with a heat radiator on the front surface of the leadframe into an integrated dual-side cooling system. This merging of cooling components on both surfaces creates a more comprehensive heat dissipation structure that addresses the insufficient cooling efficiency of single-side cooling systems.
2Temperature
If water-cooling with a coolant passage is applied to the heat sink, then cooling performance is improved, but the heat radiator interferes with the flow of coolant water
Solution Approach 1:
The patent applies local quality by providing openings in the heat radiator at positions that do not interfere with the coolant passage. The heat radiator is designed with differentiated regions: areas with openings for heat dissipation and areas that maintain structural integrity for coolant flow. This localized design allows the heat radiator to perform its cooling function without obstructing the water-cooling system.
Solution Approach 2:
The openings in the heat radiator act as intermediaries that allow coolant water to pass through the heat radiator structure. These openings serve as channels that mediate between the coolant passage and the external environment, enabling the coolant to flow freely while the heat radiator simultaneously dissipates heat from the leadframe.
3Temperature
If the heat radiator is attached to the opening of the cooling device, then uniform cooling is achieved, but the alignment precision must be high to minimize interference with coolant flow
Solution Approach 1:
The patent employs asymmetric design in the positioning of openings relative to the coolant passage. The openings are strategically placed at locations that naturally avoid interference with coolant flow paths, reducing the need for high alignment precision during assembly. This asymmetric arrangement allows for more tolerant manufacturing while maintaining uniform cooling performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances cooling efficiency, reducing the risk of overheating and degradation in power modules, thereby improving the reliability and performance of electric and hybrid electric vehicles.
Implementation Method 1
a heat radiator bonded to one surface of the sealing body... the heat radiator of the power module is attached to an opening provided on a way of the coolant passage
Implementation Method 2
a coolant passage through which coolant water flows... efficiently cooled by attaching a heat radiator to an opening formed at an upper surface portion of a cooling device
Data Source
AI summary
A power module apparatus includes a power module having a package configured to seal a perimeter of a semiconductor device, and a heat radiator bonded to one surface of the package; a cooling device having a coolant passage through which coolant water flows, in which the heat radiator is attached to an opening provided on a way of the coolant passage, wherein the heat radiator of the power module is attached to the opening of the cooling device so that a height (ha) and a height (hb) are substantially identical to each other. The power module in which the heat radiator is attached to the opening formed at the upper surface portion of the cooling device can also be efficiently cooled, and thereby it becomes possible to reduce degradation due to overheating.