Integrated-Cooling Power Module Housing With Lower Weight and Part Count
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Solution Overview
Problem
Existing power modules with metal cooling assemblies are heavy, costly, and have a high part count, requiring complex assembly and additional components for securing semiconductor modules and coolant flow guidance.
Innovation Solution
A power module design featuring a metal baseplate with an integrated cooling structure, molded within a plastic housing comprising two parts made from fiber-reinforced polymers, which form a form-fit connection and cavity for coolant, eliminating the need for additional parts and allowing for simpler manufacturing and reduced weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal cooling assemblies are used in power modules, then cooling efficiency is improved, but weight increases
Solution Approach 1:
The patent employs composite material construction by integrating a metal baseplate with plastic housing parts. The metal baseplate provides thermal conductivity for efficient cooling, while the plastic housing reduces overall weight. This composite approach allows the module to achieve effective cooling without the excessive weight of fully metal construction.
2Reliability
If additional parts are used to secure semiconductor modules and guide coolant flow, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent integrates multiple functions into the housing structure itself. The housing parts not only enclose the semiconductor modules but also directly guide coolant flow and provide structural support. By merging these functions into the housing design, the need for separate securing parts and flow guidance components is eliminated, reducing part count while maintaining reliability.
Solution Approach 2:
The housing parts serve multiple purposes simultaneously: they provide mechanical support for semiconductor modules, create fluid channels for coolant flow, and contribute to the overall structural integrity of the power module. This multi-functionality reduces the total number of components needed while ensuring reliable operation.
3Manufacturing precision
If complex assembly processes are used to assemble power modules, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The housing parts are designed with pre-formed features such as integrated mounting structures and fluid channels that are created during the molding process itself. This preliminary formation of functional features eliminates the need for subsequent complex assembly operations, allowing for both precise manufacturing and high production speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a lightweight, cost-effective power module with efficient cooling capabilities, reduced part count, and simplified assembly, using materials that are flame-resistant and compatible with typical coolants, while maintaining high strength and thermal performance.
Implementation Method 1
a first housing part made from a plastic material and molded around at least parts of the metal baseplate to establish a form-fit connection with the at least one semiconductor module
Implementation Method 2
a second housing part made from a plastic material and joined to the first housing part to form a cavity for a coolant for cooling the integrated cooling structure of the at least one semiconductor module
Data Source
AI summary
The present invention relates to a power module (101) comprising at least one semiconductor module (104) having a metal baseplate (108) with an integrated cooling structure. The power module (101) further comprises a first housing part (121) made from a plastic material and molded around at least parts of the metal baseplate (108) to establish a form-fit connection with the at least one semiconductor module (104), and a second housing part (122) made from a plastic material and joined to the first housing part (121) to form a cavity for a coolant (116) for cooling the integrated cooling structure of the at least one semiconductor module (104).The present disclosure further relates to a method for manufacturing a power module (101).