Power Module Cooling Loop Layout for Uniform Switch Heat Dissipation
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Solution Overview
Problem
Existing power electronic devices, such as inverters, face significant heat dissipation challenges due to uneven cooling of electronic switches, leading to premature failure and reduced rated power, with current cooling methods being insufficient and inefficient.
Innovation Solution
A power module design featuring a base plate with controllable electronic switches and multiple cooling devices with loops arranged in different configurations, including varying inclinations, heights, and offsets, to enhance turbulence and even cooling performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If loop-shaped cooling devices are arranged in the coolant flow to dissipate waste heat, then heat dissipation is improved, but the cooling is insufficient and switches fail prematurely
Solution Approach 1:
The patent applies local quality by varying the loop configurations of cooling devices at different locations. Specifically, cooling devices have loops with different protrusion distances from the base plate, different inclination angles, and different loop densities in different regions. This creates location-specific cooling characteristics that match the local heat generation patterns of switches, ensuring each switch receives appropriate cooling intensity to prevent premature failure.
Solution Approach 2:
The cooling system is segmented into multiple independent cooling devices, each with its own loop configuration. Rather than using a single uniform cooling structure, the patent divides the cooling function across multiple devices with varying loop arrangements (different protrusion distances, inclinations, and loop counts). This segmentation allows independent optimization of cooling for different switch regions.
2Temperature
If switches are cooled to different degrees, then cooling performance varies, but insufficiently cooled switches fail prematurely causing total failure
Solution Approach 1:
The patent implements local quality by designing cooling devices with non-uniform loop distributions. Different regions have cooling devices with loops protruding by different distances (e.g., first region: 2-5mm, second region: 5-8mm), different inclination angles, and different loop densities. This creates location-specific cooling characteristics that match the local heat generation patterns, ensuring all switches achieve adequate cooling temperatures to prevent premature failure.
Solution Approach 2:
The patent applies parameter changes by systematically varying key cooling device parameters across different locations: loop protrusion distance (2-5mm in first region, 5-8mm in second region), loop inclination angles (10-30 degrees in first region, 30-60 degrees in second region), and loop density. These parameter variations optimize cooling performance for different thermal conditions while maintaining overall system reliability.
3Temperature
If loops of cooling devices protrude by different distances, then cooling uniformity is improved, but device complexity increases
Solution Approach 1:
The patent achieves cooling uniformity through local quality by dividing the cooling system into regions with standardized loop configurations. First region cooling devices have loops protruding 2-5mm with 10-30 degree inclinations, while second region devices have loops protruding 5-8mm with 30-60 degree inclinations. Each region uses consistent parameters across its devices, making individual components simple while achieving overall uniformity through systematic regional differentiation.
Solution Approach 2:
The patent segments the cooling system into distinct regional zones with standardized configurations. By dividing the base plate into first and second regions and assigning standardized loop parameters to each region, the patent manages complexity through modularity. Each cooling device within a region follows the same design rules, simplifying manufacturing while the regional segmentation achieves overall cooling uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves cooling performance by ensuring even cooling of electronic switches, preventing premature failure and maintaining consistent operation, thereby enhancing the reliability and efficiency of power electronic devices.
Implementation Method 1
The proposed measures lead to increased turbulence of the cooling medium and thus to improved cooling performance
Implementation Method 2
This heat is sometimes dissipated using a liquid cooling medium or heat transfer medium
Implementation Method 3
the loops of a first group of cooling devices and the loops of a second group of cooling devices protrude from the second base plate side by different distances... lead to increased turbulence of the cooling medium
Data Source
Figure 1~2
Figure 3~4
Figure 5~7
AI summary
The invention relates to a power module (1) for a power electronic device, in particular for an inverter (2). The power module (1) comprises a base plate (4) with a first base plate side (A) and a second, opposite base plate side (B), controllable electronic switches (S, S1..S3') which are arranged on the first base plate side (A) or at least thermally coupled to it, inputs (E1, E2) and outputs (A1..A3) which are electrically connected to the electronic switches (S, S1..S3'). The power module (1) is configured to convert an input voltage (U) applied to the inputs (E1, E2) into an output voltage applied to the outputs (A1..A3) by means of the electronic switches (S, S1..S3'). The power module (2) comprises several cooling devices (5) attached to the second base plate side (B) or at least thermally coupled to it.The cooling devices (5) each comprise several loops (6, 6a, 6b) arranged one behind the other. The loops (6a) of a first group of cooling devices (5) are inclined relative to the loops (6b) of a second group of cooling devices (5) and/or the loops (6a) of a first group of cooling devices (5) and the loops (6b) of a second group of cooling devices (5) extend at different distances from the second base plate side (B).