Power Module Cooling Structure for Uniform Coolant Heat Dissipation
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Solution Overview
Problem
Conventional power modules face inefficiencies in heat dissipation, leading to overheating and degradation of semiconductor devices, particularly in electric vehicles and hybrid electric vehicles.
Innovation Solution
A power module apparatus with a heat radiator attached to an opening on a coolant passage of a cooling device, ensuring uniform coolant flow and efficient heat dissipation by aligning the height of the radiator with the coolant passage surfaces, and a three-dimensional assembly of cooling devices to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is disposed on the back side surface of the leadframe for dissipating heat, then heat dissipation capability is improved, but the cooling efficiency is insufficient leading to overheating and degradation of semiconductor devices
Solution Approach 1:
The invention transitions from conventional two-dimensional heat dissipation (heat sink on leadframe back surface) to three-dimensional cooling by attaching the heat radiator to the opening on the coolant passage way, enabling coolant to directly contact and cool the semiconductor device from multiple directions, thereby significantly improving cooling efficiency and preventing overheating-induced degradation
2Temperature
If water-cooling with a coolant passage formed on the back side surface of the heat sink is implemented, then cooling performance is improved, but uniform cooling is not achieved resulting in localized overheating
Solution Approach 1:
The invention applies local quality by positioning the heat radiator with specific height relationships to different sides of the coolant passage, creating non-uniform attachment that compensates for heat generation patterns. The heat radiator is attached such that heights from inner surfaces to the heat radiator surface are substantially identical, ensuring uniform heat dissipation across the semiconductor device surface despite the asymmetric coolant flow path
3Productivity
If the heat radiator is attached to the opening of the cooling device, then heat dissipation efficiency is improved, but precise alignment with the coolant passage is required to achieve uniform cooling
Solution Approach 1:
The invention creates equipotentiality in terms of heat dissipation by designing the heat radiator attachment such that the heights from inner surfaces of opposite sides of the coolant passage to the heat radiator surface are substantially identical. This symmetric height relationship ensures that cooling conditions are equalized across the semiconductor device, achieving uniform heat dissipation without requiring ultra-precise alignment during assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces overheating-related degradation by ensuring uniform cooling across the radiator, enhancing the performance and reliability of power modules in electric vehicles.
Implementation Method 1
a heat radiator bonded to one surface of the sealing body
Implementation Method 2
a coolant passage through which coolant water flows
Data Source
AI summary
A power module apparatus includes a power module having a package configured to seal a perimeter of a semiconductor device, and a heat radiator bonded to one surface of the package; a cooling device having a coolant passage through which coolant water flows, in which the heat radiator is attached to an opening provided on a way of the coolant passage, wherein the heat radiator of the power module is attached to the opening of the cooling device so that a height (ha) and a height (hb) are substantially identical to each other. The power module in which the heat radiator is attached to the opening formed at the upper surface portion of the cooling device can also be efficiently cooled, and thereby it becomes possible to reduce degradation due to overheating.