Power Module Heat Sink Assembly With Bonded Copper Cooling

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Solution Overview

Problem

Existing methods for producing electronic assemblies with heat sinks and electrical power modules are complex, costly, and prone to leaks, requiring intricate cooling structures and sealing mechanisms that complicate manufacturing and reduce operational reliability.

Innovation Solution

A method involving a heat sink with a copper layer in a flat depression, where the copper layer is applied to form a stable connection with the power module's copper layer, allowing direct fastening and efficient heat dissipation without the need for additional fastening elements or sealing, utilizing the high thermal conductivity of copper to enhance cooling and reduce production costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If direct contact cooling structure is used with power module, then heat dissipation efficiency is improved, but sealing complexity and leak risk increase

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidsealing reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The copper layer on the power module carrier element and the copper layer on the heat sink are merged through direct material bonding to form an integrated thermal connection. This eliminates the need for separate sealing structures while maintaining effective heat transfer from the power module to the cooling medium.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The mechanical sealing system (seals, gaskets, fastening elements) is replaced by a material bonding system where copper layers are directly bonded together. This substitution eliminates mechanical sealing components that are prone to leakage while maintaining the thermal connection.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If multiple fastening elements and seals are used, then operational reliability is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveoperational reliabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple separate components (fastening elements, seals, cooling structures) are merged into a simplified assembly where copper layers are directly bonded. The copper layers serve dual functions as both structural bonding elements and thermal conduction paths, eliminating the need for separate fastening and sealing components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The copper layers serve multiple functions simultaneously: they provide structural support, enable material bonding for fastening, conduct heat from the power module, and create the sealing interface. This multi-functionality reduces the total number of components needed in the assembly.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If traditional cooling structures with seals are used, then leak prevention is improved, but production time and cost increase

Engineering Contradiction:

Improveleak preventionVSAvoidproduction efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The mechanical sealing system is replaced by a material bonding system where copper layers are directly bonded together. This substitution eliminates the need for separate sealing components and reduces assembly steps, thereby improving production efficiency while maintaining leak prevention through the bonded copper interface.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The copper layers are prepared in advance on both the power module carrier element and the heat sink before assembly. This preliminary preparation allows for rapid assembly through direct bonding without requiring complex sealing operations during final assembly, thus improving production efficiency.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the production process, reduces costs, enhances reliability, and improves heat dissipation, increasing the service life of the electronic assembly by eliminating the need for screws, clamping blocks, and seals, while allowing for more compact and lightweight designs.

Implementation Method 1

the copper layer of the carrier element is arranged on a further copper layer, wherein the copper layer is connected to the further copper layer, wherein the electrical power module is fastened on the heat sink via the copper layer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

In a joining step, the respective ceramic plate is connected by material bonding to the upper side of an aluminum body with the supply of heat

Methodology Applied

Scientific EffectMaterial bonding: Welding

Data Source

PatentUS20240030100A1Method for producing an electronic assembly, electronic assembly, and motor vehicle

Publication Date: 2024.01.25 AUDI AG

AI summary

A method for producing an electronic assembly including providing at least one electrical power module, providing a heat sink having at least one flat depression in at least one side and applying a further copper layer in the flat depression, or providing a heat sink and applying a further copper layer to form a flat depression, or providing a heat sink having at least one flat depression in at least one side, wherein a further copper layer is applied in the depression, arranging the copper layer of the carrier element on the further copper layer, and connecting the copper layer to the further copper layer to fasten the electrical power module on the heat sink.