Half-Bridge Power Module Wiring With Integrated Corrosion Sensing
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Solution Overview
Problem
Conventional power semiconductor modules are vulnerable to corrosion from corrosive gases, which can lead to unexpected failures due to the inability to effectively detect and monitor corrosion within the module, especially in environments where gases like hydrogen sulfide are present.
Innovation Solution
Integration of corrosion sensors using metal resistive wires within the power semiconductor module, specifically designed to detect corrosion by monitoring resistance value changes, allowing for early detection and prevention of module failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin or gel sealing is used for insulation, then electrical insulation is achieved, but corrosive gas permeation occurs leading to undetected wire corrosion
Solution Approach 1:
The patent merges the insulation function with the corrosion detection function by integrating corrosion sensors (metal resistive wires) within the resin-sealed module. The sensors are embedded in the same resin medium that provides electrical insulation, allowing simultaneous achievement of insulation and corrosion monitoring without adding separate external monitoring systems.
Solution Approach 2:
The corrosion sensors provide continuous feedback on the corrosion state of wiring members by monitoring resistance changes. This feedback mechanism enables early detection of corrosion before it causes failure, allowing preventive maintenance or system shutdown to avoid unexpected operational failures.
2Measurement precision
If multiple kinds of metals with different corrosion rates are used for corrosion sensing, then corrosion detection capability is improved, but device complexity and installation difficulty increase
Solution Approach 1:
The patent uses wiring members made of the same metal material as the actual wiring in the power semiconductor module. This homogeneous material selection simplifies the corrosion sensor configuration while maintaining accurate corrosion detection capability, as the sensor experiences the same corrosion environment and rate as the protected wiring.
Solution Approach 2:
The wiring members serve dual functions: they act as both the electrical conductors for power transmission and as corrosion sensors for monitoring. This multi-functionality eliminates the need for separate sensor components and complex configurations, reducing device complexity while maintaining detection accuracy.
3Reliability
If corrosion sensors are integrated into compact module designs, then early corrosion detection is enabled, but installation space becomes limited
Solution Approach 1:
The corrosion sensors are merged with the existing wiring members within the module, eliminating the need for separate sensor components. The metal resistive wires that form the wiring members also serve as the corrosion sensors, utilizing the same physical space and structural elements already present in the compact module design.
Solution Approach 2:
The wiring members perform dual roles as both electrical conductors and corrosion sensors. This multi-functionality allows corrosion detection capability to be integrated without adding extra components or increasing module volume, maintaining compact design while enabling reliable corrosion monitoring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables early detection of corrosion, allowing for timely intervention and preventing unexpected module failures by integrating corrosion sensors that are easily installable and cost-effective, even in compact module designs.
Implementation Method 1
a first corrosion sensor disposed in an installation environment of the first wiring member, a second corrosion sensor disposed in an installation environment of the second wiring member, or a third corrosion sensor disposed in an installation environment of the third wiring member
Data Source
AI summary
A power semiconductor module includes a half-bridge circuit having a first power semiconductor element and a second power semiconductor element that are connected in series with each other. The power semiconductor module also includes first to third external terminals, a first wiring member that connects a high-potential-side main electrode of the first power semiconductor element to the first external terminal, a second wiring member that connects a low-potential-side main electrode of the second power semiconductor element to the second external terminal, a third wiring member that connects an output of the half-bridge circuit to a third external terminal, and at least one of a first corrosion sensor disposed in an installation environment of the first wiring member, a second corrosion sensor disposed in an installation environment of the second wiring member, or a third corrosion sensor disposed in an installation environment of the third wiring member.