Power Module Heat Sink Crimp Structure for Easier Integration
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Solution Overview
Problem
Existing heat sink-integrated power semiconductor modules face challenges in improving productivity during the integration of the power module unit and the heat sink.
Innovation Solution
The power semiconductor device incorporates a power module unit and a heat sink base unit with uneven portions that include buffer depression portions, allowing for a space when bonded, reducing the load required for integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the module base and heat sink base unit are tightly fitted together without buffer space, then the bonding strength is improved, but the press load required for integration increases and positioning becomes more difficult
Solution Approach 1:
The buffer depression portion is designed in advance within the uneven portion structure. This pre-planned buffer space absorbs excess press load and prevents over-compression, allowing for easier positioning while maintaining adequate bonding strength. The buffer portion acts as a cushion that accommodates dimensional variations and positioning tolerances before the actual bonding interface is engaged.
2Productivity
If the press load is reduced for easier integration, then productivity is improved, but the bonding strength between module base and heat sink may be insufficient
Solution Approach 1:
The uneven portion structure creates localized bonding zones with high contact pressure. The protrusions and depressions are strategically positioned to concentrate the press load at specific bonding interfaces, ensuring adequate bonding strength in critical areas while allowing the overall press load to be reduced for improved productivity.
3Manufacturing precision
If the positioning precision is increased for better integration, then the bonding quality is improved, but the complexity of the positioning mechanism increases
Solution Approach 1:
The uneven portion structure with buffer depression enables self-positioning during the integration process. The geometric features guide the module base and heat sink base unit into proper alignment automatically, reducing the need for complex external positioning mechanisms while maintaining adequate bonding quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances productivity by reducing the press load and enabling simpler positioning, leading to higher efficiency in the integration process.
Implementation Method 1
The module base and the heat sink base unit are integrated by placing the first uneven portion and the second uneven portion to face each other, pressing one of the module base in the power module unit and the heat sink base unit against the other, and fitting the first uneven portion and the second uneven portion together.
Data Source
AI summary
A power semiconductor device includes a power module unit and a heat sink. An uneven portion is formed in a module base in the power module unit. The uneven portion includes a depression portion and a buffer depression portion. An uneven portion is formed in a heat sink base unit in the heat sink. The uneven portion and the uneven portion are fitted together by crimping so that the module base of the power module unit and a heat dissipation spreader of the heat sink are integrated. The buffer depression portion is left as a space.