Power Module Central Substrate Layout for Shorter Current Loops
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Solution Overview
Problem
The increasing heat generation in power modules due to higher output requirements and larger components leads to reliability issues, such as deteriorated electrical characteristics and substrate warping, particularly in double-sided cooling methods.
Innovation Solution
A central substrate is introduced between upper and lower substrates, forming a current path that intersects with the vertical path, simplifying the current loop and enhancing current overlap through conductive and insulating parts, reducing the size of insulating patterns and via spacers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the sizes of components such as semiconductor chips and substrates are increased to handle increased heat generation, then heat dissipation capability is improved, but current loops become longer and more complex, leading to deterioration of electrical characteristics and substrate warping
Solution Approach 1:
The patent introduces a central substrate positioned between the upper and lower substrates, creating a three-dimensional current path structure. This central substrate provides additional vertical current paths that intersect with the horizontal current paths in the upper and lower substrates, effectively shortening the overall current loop length and reducing complexity while maintaining heat dissipation capability through the multi-layer thermal conduction structure
2Reliability
If a central substrate is added between upper and lower substrates, then current loop is simplified and current overlap is enhanced, but device complexity increases
Solution Approach 1:
The central substrate serves multiple functions simultaneously: it provides additional current paths to shorten the current loop, acts as a thermal conduction path for heat dissipation, and provides structural support between the upper and lower substrates. By integrating these multiple functions into a single component, the patent enhances current overlap and simplifies the current loop without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves operating efficiency by narrowing the current loop, increasing current overlap, and reducing the overall module size, thereby stabilizing the power module's operation.
Implementation Method 1
a cooling channel is connected to a substrate and refrigerant is circulated through the cooling channel to enhance cooling efficiency through heat exchange between the refrigerant and the substrate
Implementation Method 2
heat transfer occurs while a substrate is directly coupled to a cooling channel
Data Source
AI summary
In the present disclosure, a central substrate is additionally disposed between an upper and lower substrates, thereby simplifying a current loop of a module. In addition, by simplifying the current loop between the upper and lower substrates, the central substrate enhances current overlap effect. Further disclosed is a power module in which an insulating pattern and a via spacer to form the current loop are reduced in size, resulting in a reduction of the overall module size.