Power Module Connection Layer for Shorter Current Loops
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Solution Overview
Problem
The increasing heat generation and size requirements of power modules in electrified vehicles, particularly due to higher output demands, lead to complex current loops and reliability issues such as degradation in electrical characteristics and substrate bending.
Innovation Solution
A power module design with an additional connection layer between the upper and lower substrates, incorporating spacers and connection layers to simplify current loops and enhance current overlap, reducing module size and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the size of power module parts is increased to cope with increased heat amount, then heat dissipation capability is improved, but current loop becomes long and complex leading to reliability degradation
Solution Approach 1:
The connection layer introduces a new dimensional approach by creating a horizontal current path between spacers that are vertically positioned. This cross-directional connection (perpendicular to the vertical spacer arrangement) effectively shortens the current loop length without increasing the vertical height of components, thus maintaining compact module size while improving electrical characteristics
2Temperature
If the size of power module parts is increased to cope with increased heat amount, then heat dissipation capability is improved, but module size increases
Solution Approach 1:
By establishing current paths in a direction crossing the vertical spacer arrangement, the connection layer enables efficient current flow without requiring increased vertical height. This allows the module to maintain compact dimensions while achieving improved heat dissipation through enhanced current overlap and reduced loop inductance
3Reliability
If spacers are disposed closely to each other, then current overlap effect is enhanced, but current loop becomes complex
Solution Approach 1:
The connection layer is divided into multiple regions corresponding to different spacer positions, with each region providing localized current paths. This segmentation allows close spacer spacing for enhanced current overlap while maintaining a systematic and manageable current loop structure through organized regional connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simplified current loop design enhances operation efficiency and reliability by increasing current overlap, reducing module size, and improving cooling performance.
Implementation Method 1
a first connection layer configured to form a current path between the upper substrate and the lower substrate and between the first spacer and the second spacer
Implementation Method 2
a first spacer electrically interconnecting the first metal layer and the second metal layer while extending vertically, a second spacer electrically interconnecting the first semiconductor chip and the first metal layer
Data Source
AI summary
A power module includes an upper substrate, a lower substrate, a first semiconductor chip, a first spacer electrically interconnecting a first metal layer of the upper substrate and a second metal layer of the lower substrate, a second spacer electrically interconnecting the first semiconductor chip and the first metal layer, and a first connection layer configured to form a current path, and a power lead.