Power Module Case With Deforming Side Walls
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing power semiconductor modules face challenges in maintaining stable compressive stress in the insulating adhesive layer due to variations in the pressing force during assembly, which can lead to heat dissipating units detaching from the power semiconductor module.
Innovation Solution
The power module design includes a case with a first and second case member, where the side wall portions are formed to have a combined length shorter than the circuit body's thickness, and a deforming portion with reduced rigidity is used to absorb dimensional variations and maintain compressive stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the distance between fin plates is formed smaller than the thickness of the circuit body, then compressive stress can be generated in the insulating adhesive, but the pressing force varies during assembly making it difficult to generate desired compressive stress stably
Solution Approach 1:
The invention changes the geometric parameters of the case structure by forming recesses in the fin plates that extend toward the circuit body. This modifies the effective distance between fin plates in specific regions, allowing the case to maintain compressive stress on the insulating adhesive while accommodating dimensional variations during assembly. The recesses create zones where the pressing force is distributed more evenly, stabilizing the compressive stress despite variations in assembly pressing force.
2Ease of operation
If the case is widened to accommodate the circuit body, then the circuit body can be inserted, but the pressing force of the fin base portion decreases
Solution Approach 1:
The invention segments the fin plate structure by forming recesses that create localized zones of increased pressing force. While the overall case width is increased to accommodate the circuit body easily, the recesses concentrate the pressing force at specific locations where the fin bases contact the circuit body. This segmentation allows the case to be wide enough for easy insertion while maintaining sufficient pressing force at critical contact points through the recess structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation reliability by preventing separation of the heat dissipating unit from the power semiconductor module, thereby improving the overall reliability of the power module.
Implementation Method 1
The metal-made case has heat dissipating units to be attached to the respective conductive plates with an insulating adhesive having thermal conductivity
Data Source
AI summary
An object of the present invention is to provide a power module having high reliability. The power module according to the present invention, includes a circuit body and a case housing the circuit body. The case has a first case member including a first base plate and a second case member including a second base plate. The first case member has a first side wall portion formed in an arrangement direction of the first base plate and the second base plate. The second case member has a second side wall portion formed in the arrangement direction, the second side wall portion coupling to the first side wall portion. The first side wall portion and the second side wall portion are formed so as to have the sum of lengths of the first side wall portion and the second side wall portion in the arrangement direction smaller than the thickness of the circuit body. The first case member has a deforming portion smaller than the first base plate and the second base plate in rigidity.