Power Module Structure-Borne Sound Delamination Detection
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Solution Overview
Problem
Conventional methods for determining aging processes in power modules within integrated circuit packaging rely on temperature-sensitive parameters, which require additional components and are susceptible to interference.
Innovation Solution
A power module that produces structure-borne sound using a control unit and piezoelectric material, integrated with MEMS sensors to detect IC package delamination without external components, utilizing a control unit to excite the piezoelectric material and compare acquired signals to a reference value.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature-sensitive parameters are used to determine aging processes, then temperature measurement is achieved, but additional components are required and the measurement is susceptible to interference
Solution Approach 1:
The power module uses its own piezoelectric material and control unit to generate structure-borne sound signals and detect delamination internally, without requiring external test equipment or additional temperature-sensitive components. The system performs self-diagnosis by exciting the piezoelectric material with control signals and evaluating the resulting acoustic responses.
Solution Approach 2:
The patent replaces temperature-based measurement systems with an acoustic vibration-based system. Instead of using temperature-sensitive parameters and associated measurement circuitry, the invention uses structure-borne sound signals generated by piezoelectric material to detect package integrity, substituting thermal measurement with mechanical/acoustic measurement.
2Measurement precision
If temperature-sensitive parameters are used to determine aging processes, then temperature measurement is achieved, but the measurement is susceptible to interference
Solution Approach 1:
The patent replaces temperature-based measurement systems with an acoustic vibration-based system. Instead of using temperature-sensitive parameters and associated measurement circuitry, the invention uses structure-borne sound signals generated by piezoelectric material to detect package integrity, substituting thermal measurement with mechanical/acoustic measurement.
Solution Approach 2:
The power module uses its own piezoelectric material and control unit to generate structure-borne sound signals and detect delamination internally, without requiring external test equipment or additional temperature-sensitive components. The system performs self-diagnosis by exciting the piezoelectric material with control signals and evaluating the resulting acoustic responses.
3Device complexity
If module-integrated structure-borne sound production is implemented, then external components are eliminated, but piezoelectric material integration is required
Solution Approach 1:
The piezoelectric material serves multiple functions within the power module: it acts as a structural component of the substrate, a transducer for generating structure-borne sound signals when excited by the control unit, and a medium for detecting package delamination through acoustic response analysis. This multi-functionality eliminates the need for separate dedicated test components.
Solution Approach 2:
The invention merges the test function with the existing substrate structure by integrating piezoelectric material directly into the substrate. The control unit and piezoelectric substrate work together as an integrated test system, combining diagnostic capabilities with the module's existing architecture rather than adding separate external test equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables module-integrated structure-borne sound production and delamination detection, reducing susceptibility to interference and eliminating the need for external components, while maintaining low costs and high integration density.
Implementation Method 1
the second substrate has a piezoelectric material, and the control unit is set up to excite the piezoelectric material of the second substrate so that a structure-borne sound signal is produced
Implementation Method 2
the MEMS sensor being set up to acquire the produced structure-borne sound signal
Data Source
AI summary
A power module for producing structure-borne sound. The power module includes: a control unit and a first substrate, the control unit being situated on the first substrate; at least one first power semiconductor and at least one second power semiconductor, the first substrate being situated on the at least one first power semiconductor and on the at least one second power semiconductor; a first metal connection, a second substrate, and a second metal connection, the first metal connection electrically connecting the first substrate and the second substrate, and the second metal connection being situated below the second substrate, wherein the second substrate has a piezoelectric material and the control unit is set up to excite the piezoelectric material of the second substrate so that a structure-borne sound signal is produced.