Power Module Die-Surface Temperature Sensing via Conductive Overlay
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Solution Overview
Problem
Existing power modules lack a direct and efficient method for temperature sensing on the die surface, relying on indirect methods that increase operational costs and limit reliability and safety.
Innovation Solution
The implementation of conductive overlays with directly mounted temperature sensors provides a fast and accurate method for temperature measurement, enhancing the reliability and safety of power modules by allowing for direct temperature sensing on the die surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If indirect temperature sensing methods are used from PCB control circuitry, then device complexity is reduced, but measurement precision and reliability deteriorate
Solution Approach 1:
The patent introduces an intermediary temperature sensor that directly contacts the die surface through a thermal interface, acting as a mediator between the heat source and the measurement system. This intermediary enables direct temperature measurement without complex indirect sensing circuitry, resolving the contradiction between simplicity and accuracy.
2Ease of manufacture
If indirect temperature sensing methods are employed, then ease of manufacture is improved, but reliability deteriorates
Solution Approach 1:
The temperature sensor serves as a reliable intermediary that directly measures die surface temperature, providing accurate thermal data for safety and reliability control. This direct measurement approach maintains manufacturing simplicity while significantly improving operational reliability compared to indirect methods.
3Measurement precision
If direct temperature sensing on die surface is implemented, then measurement precision improves, but device complexity increases
Solution Approach 1:
The patent uses a temperature sensor as an intermediary component that directly contacts the die surface through a thermal interface. This approach achieves high measurement precision while adding minimal structural complexity, as the sensor can be integrated into existing module architectures without major redesign.
4Ease of operation
If conventional temperature sensing approaches are used, then ease of operation is maintained, but thermal management effectiveness deteriorates
Solution Approach 1:
The patent implements direct temperature sensing that provides accurate real-time feedback on die surface temperature. This feedback enables effective thermal management by allowing control systems to respond to actual thermal conditions, improving upon conventional approaches that rely on indirect and less accurate temperature information.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise temperature monitoring, improving the operational reliability and safety of power modules by providing direct and accurate temperature measurements, which can lead to better thermal management and extended module lifespan.
Implementation Method 1
the temperature sensors 104 directly measure a surface temperature of the conductive overlays 102
Data Source
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AI summary
Systems and methods for accurate and fast measurement of junction temperature for power modules are provided. Such systems and methods include a one or more power transistors (108) that each have a respective die surface over which is positioned and electrically coupled to a conductive overlay (102). A temperature sensor is physically bonded to a top surface of the conductive overlay (102) to provide a direct temperature measurement for the one or more power transistors (108).