Semiconductor Power Module Layout for Diode-Side Heat Dissipation
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Solution Overview
Problem
Semiconductor power modules in power converters, such as inverters for electric vehicles, face challenges with heat dissipation due to high power losses, particularly when using semiconductor switching elements with low thermal conductivity, which can lead to overheating and impaired functionality.
Innovation Solution
The semiconductor power module incorporates a cooler thermally coupled to the switching elements, with diodes positioned to face the cooler for effective heat dissipation, and uses leadframes to electrically connect bipolar transistors and Schottky diodes in a half-bridge configuration, enhancing heat dissipation and protecting the components from overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If semiconductor switching elements with low thermal conductivity are used, then device complexity is reduced, but heat dissipation becomes insufficient leading to overheating
Solution Approach 1:
The patent applies local quality by creating an asymmetric thermal pathway where the cooler is positioned to face only the anode region of the diodes, which is the primary heat generation zone. This localized cooling approach concentrates thermal management resources where they are most needed, improving heat dissipation efficiency without requiring comprehensive cooling of the entire semiconductor structure.
Solution Approach 2:
The patent transitions from conventional planar cooling to a three-dimensional thermal management architecture by positioning the cooler to face the anode from a specific direction. This spatial arrangement creates an optimized thermal pathway that extends in the vertical dimension, allowing heat to be conducted more effectively from the heat-generating anode region to the cooler without increasing lateral footprint.
2Temperature
If cooler is added to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges the cooling function directly with the existing semiconductor structure by integrating the cooler as an inherent component of the power module assembly. The cooler is positioned to thermally couple with the anode region, combining thermal management with the electrical connection structure, thereby reducing the need for separate, complex cooling systems.
Solution Approach 2:
Rather than implementing a comprehensive cooling system for the entire semiconductor device, the patent applies cooling only to the specific anode region where heat is generated. This localized approach reduces the overall complexity of the thermal management system while effectively addressing the heat dissipation problem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat generated by high power losses, protecting semiconductor switching elements and improving the functionality of the power converter by preventing overheating.
Implementation Method 1
heat which is produced owing to high power losses in the semiconductor switching elements cannot be dissipated sufficiently effectively
Data Source
AI summary
A semiconductor power module for an electrical axle drive in an electric vehicle and/or a hybrid vehicle includes a plurality of semiconductor switching elements for generating an output current on the basis of an input current provided by a voltage source by switching the semiconductor switching elements comprising a plurality of diodes which each have an anode and a cathode, a first leadframe, and a second leadframe having a plurality of conductor tracks for electrically connecting the semiconductor switching elements to form a half-bridge having a high side and a low side, wherein the first leadframe is assigned to the high side and the second leadframe is assigned to the low side, wherein electrical contact is made with the diodes between the first leadframe and the second leadframe so that the anode of the diodes faces a cooler mechanically connected and thermally coupled to the semiconductor power module.