Power Semiconductor Module with Direct Device Temperature Sensing
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Solution Overview
Problem
Conventional methods for temperature detection in power semiconductor modules face challenges such as conduction loss, reduced active area, and delayed real-time temperature measurement due to indirect sensing through ceramic substrates, leading to inaccuracies.
Innovation Solution
A temperature sensor is directly placed on the semiconductor device, connected to a copper clip bonded to its upper surface, allowing for direct and accurate temperature measurement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensing pad is inserted at the semiconductor device bonding portion, then temperature detection is enabled, but conduction loss occurs and active area decreases
Solution Approach 1:
The temperature sensing function is extracted from the semiconductor device bonding portion and relocated to a separate temperature sensor component. This allows temperature detection without compromising the active area or causing conduction loss in the semiconductor device itself.
Solution Approach 2:
A temperature sensor acts as an intermediary component to detect the temperature of the semiconductor device. This mediator allows indirect temperature measurement without direct electrical contact that would cause conduction loss, while still providing accurate temperature data.
2Measurement precision
If an NTC thermistor is attached to the substrate to indirectly sense temperature, then temperature sensing is achieved, but real-time temperature detection is delayed due to ceramic substrate thermal transmission time
Solution Approach 1:
A copper clip serves as a thermal intermediary with high thermal conductivity between the semiconductor device and the temperature sensor. This mediator rapidly transmits thermal energy, enabling real-time temperature detection without the delays associated with ceramic substrate thermal transmission.
Solution Approach 2:
The thermal conduction path is changed from low-conductivity ceramic substrate to high-conductivity copper clip. This parameter change in thermal conductivity enables rapid heat transfer and real-time temperature detection while maintaining accurate temperature measurement.
3Measurement precision
If an NTC thermistor is placed on the substrate, then temperature sensing is enabled, but temperature accuracy is reduced due to thermal conduction differences and power application effects
Solution Approach 1:
The copper clip functions as a superior thermal intermediary that provides uniform thermal conduction and electrical isolation. This mediator ensures accurate temperature measurement by eliminating the thermal conduction differences and power application effects that compromise accuracy when using NTC thermistors directly on the substrate.
Solution Approach 2:
The temperature sensor is positioned locally on the copper clip that is in direct thermal contact with the semiconductor device bonding portion. This local quality approach ensures the sensor measures the actual device temperature accurately, while the copper clip provides uniform thermal distribution to eliminate measurement errors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances temperature detection accuracy and efficiency, enabling precise current adjustments and improved operating performance of the semiconductor device.
Implementation Method 1
a copper clip of which one side is bonded to an upper surface of the semiconductor device and the other side is bonded to another copper part adjacent to the copper part including the semiconductor device
Implementation Method 2
a temperature sensor configured to detect a temperature of the semiconductor device, wherein the temperature sensor is connected to an upper end of the copper clip
Data Source
AI summary
The present invention relates to a power semiconductor module including a temperature sensor, and more particularly, to a power semiconductor module including a temperature sensor in which temperature detection efficiency is increased by placing the temperature sensor on a semiconductor device. An object of the present invention is to accurately measure a temperature of a semiconductor device in real time by placing a temperature sensor directly on the semiconductor device.