Vehicle Power Module With Integrated Double-Sided Cooling
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Solution Overview
Problem
Double-sided cooling power modules for electric vehicles face inefficiencies in heat dissipation and manufacturing processes due to conventional cooling designs, which hinder effective heat management and vibration resilience for high-voltage semiconductor chips.
Innovation Solution
A power module design featuring a cooling channel directly bonded to the circuit board and coupled to a cooler, with an insulator surrounding the circuit board and semiconductor chip, and a copper clip for improved electrical conductivity, along with a symmetric double-sided cooling structure and epoxy resin molding for enhanced insulation and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional cooling design is used in double-sided cooling power modules, then the structure is simpler to manufacture, but the heat dissipation efficiency is insufficient for high-voltage semiconductor chips
Solution Approach 1:
The patent merges the cooling channel structure with the circuit board by directly bonding the cooling channel to the lower side of the circuit board, creating an integrated thermal management system. This integration improves heat dissipation efficiency while reducing the number of separate components, thus addressing the contradiction between heat dissipation performance and structural complexity
Solution Approach 2:
The patent implements double-sided cooling by adding cooling channels to both the upper and lower sides of the circuit board, transitioning from single-sided to dual-sided thermal management. This dimensional expansion significantly enhances heat dissipation capacity by providing additional cooling pathways without proportionally increasing structural complexity
2Reliability
If high strength bonding is used to withstand vibration, then the mechanical reliability improves, but the heat dissipation performance may be compromised
Solution Approach 1:
The patent employs composite material structures, including copper clips with high thermal and electrical conductivity for bonding semiconductor chips to the circuit board, and epoxy resin molding for structural support. These composite materials simultaneously provide mechanical strength for vibration resistance and thermal pathways for heat dissipation, resolving the contradiction between mechanical reliability and thermal performance
3Temperature
If the cooling channel is directly bonded to the circuit board, then the heat dissipation efficiency improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent introduces copper clips as intermediary bonding elements between the semiconductor chips and the circuit board, and uses epoxy resin as a molding compound that encapsulates and secures the cooling channels. These intermediary materials provide tolerance for manufacturing variations while maintaining effective thermal contact, thus reducing the stringency of bonding precision requirements while preserving cooling efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly enhances cooling efficiency, reduces manufacturing complexity, and improves electrical performance by direct heat dissipation and increased thermal conductivity, addressing the limitations of conventional power modules.
Implementation Method 1
a first cooling channel coupled to a second side of the first circuit board and inserted in and jointed to a first coolant flow channel of a first cooler
Implementation Method 2
an insulator surrounding outer sides of the first circuit board and the first semiconductor chip and a lateral side of the first cooling channel
Implementation Method 3
a copper clip to connect with the first semiconductor chip or the lead frame as coupled to the first side of the first circuit board
Data Source
AI summary
A power module for a vehicle includes: a circuit board including a circuit pattern; a semiconductor chip connected to a first side of the circuit board; a lead frame disposed on the circuit board as being spaced apart from the semiconductor chip, and electrically connected to the semiconductor chip; and a cooling channel coupled to a second side of the circuit board and inserted in and jointed to a coolant flow channel of a cooler.