Power Semiconductor Module Layout for Double-Sided Heat Dissipation
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Solution Overview
Problem
Current power semiconductor modules face challenges in heat dissipation and power density due to inefficient cooling through the top side, which increases thermal resistance and production costs.
Innovation Solution
A semiconductor module design featuring two electrically insulating substrates with semiconductor devices mounted on opposite sides, allowing for efficient heat dissipation from both sides and improved power density, while maintaining low costs and process complexity using established assembly technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If double-sided cooling is implemented with heat dissipation plates on both sides of semiconductor devices, then heat dissipation efficiency is improved, but production cost and process complexity increase significantly
Solution Approach 1:
The module is divided into two separate substrates (first substrate and second substrate) with semiconductor devices mounted on opposite sides. Each substrate independently manages heat dissipation from its respective side, segmenting the cooling function while maintaining structural simplicity. This avoids the complexity of single-piece double-sided heat sinks while achieving comparable thermal performance.
Solution Approach 2:
Electrically insulating substrates serve as intermediary components between the semiconductor devices and the external environment. These substrates provide both mechanical support and thermal conduction pathways while electrically isolating the conductive elements on opposite sides, eliminating the need for complex insulation designs in double-sided cooling systems.
2Temperature
If thermally conductive material is attached to the top side of semiconductor devices for heat removal, then thermal resistance is reduced, but electrical connection reliability is compromised
Solution Approach 1:
The module separates electrical connection functions and thermal management functions into distinct areas. The top side of semiconductor devices on the first substrate maintains electrical connections, while the bottom side of devices on the second substrate handles heat dissipation. This spatial segmentation allows both functions to operate optimally without interference.
Solution Approach 2:
The patent creates a symmetrical structure where both substrates have similar configurations of semiconductor devices and connection terminals. This copying approach distributes thermal and electrical functions evenly across the module, providing redundancy and balanced performance while simplifying the design process.
3Strength
If spacer is mounted across the entire top side of semiconductor device for height adjustment, then mechanical support is improved, but electrical connections are damaged
Solution Approach 1:
The mechanical support function is distributed through multiple localized support points rather than a single continuous spacer. The first and second substrates themselves provide structural support, eliminating the need for additional spacers that would interfere with electrical connections. This segmented support approach maintains mechanical integrity while preserving electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves enhanced heat dissipation and increased power density by exposing second main surfaces of the substrates for better thermal conductivity and heat sink mounting, reducing thermal resistance and production costs.
Implementation Method 1
The substrates are arranged opposite to each other so that their first main surfaces are facing each other... the second main surfaces of each of the substrates are exposed on opposite sides of the encapsulation... for better thermal conductivity and heat sink mounting
Data Source
AI summary
The present disclosure relates to a semiconductor module, especially a power semiconductor module, in which the heat dissipation is improved and the power density is increased. The semiconductor module may include at least two electrically insulating substrates, each having a first main surface and a second main surface opposite to the first main surface. On the first main surface of each of the substrates, at least one semiconductor device is mounted. An external terminal is connected to the first main surface of at least one of the substrates. The substrates are arranged opposite to each other so that their first main surfaces are facing each other.