Power Semiconductor Module Comprising a First and a Second Compartment and Method for Fabricating the Same
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Solution Overview
Problem
High-performance encapsulation materials required for power semiconductor modules to handle extreme temperatures are costly, increasing the overall cost and material consumption, while existing materials may not efficiently manage temperature peaks during operation.
Innovation Solution
A power semiconductor module design featuring a housing with divided compartments, using a high-thermostability first encapsulation material for components that reach high temperatures and a less expensive second encapsulation material for areas that do not, reducing material usage and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high-performance encapsulation materials are used to handle extreme temperatures, then thermal stability is improved, but material cost and overall module cost increase
Solution Approach 1:
The patent applies different encapsulation materials to different compartments based on their specific thermal requirements. The first compartment containing power semiconductor dies uses a high-performance encapsulation material with high thermostability, while the second compartment uses a standard encapsulation material. This local differentiation allows the module to handle extreme temperatures where needed without incurring the high cost of using expensive materials throughout the entire module, thus resolving the contradiction between thermal stability and material cost.
2Temperature
If high-performance encapsulation materials are used to handle extreme temperatures, then thermal stability is improved, but material consumption increases
Solution Approach 1:
The patent implements local quality by restricting the use of high-performance encapsulation material to only the first compartment where power semiconductor dies are located and high temperatures occur. The second compartment uses standard encapsulation material. This approach maintains thermal stability in the critical area while significantly reducing overall material consumption compared to using high-performance materials throughout the entire module.
3Ease of manufacture
If a single encapsulation material is used throughout the module, then manufacturing simplicity is maintained, but thermal management efficiency decreases
Solution Approach 1:
The patent divides the module into two compartments with different encapsulation materials optimized for their specific thermal environments. The first compartment uses high-performance material for areas with extreme temperatures, while the second compartment uses standard material for cooler areas. This local differentiation improves thermal management efficiency by matching material properties to thermal requirements, while the compartmentalization structure maintains reasonable manufacturing simplicity.
Data Source
AI summary
A power semiconductor module includes a power semiconductor die arranged on a power substrate, a housing enclosing the power semiconductor die and the power substrate, wherein an interior volume formed by the housing is divided by interior walls into at least a first compartment and a second compartment, wherein the power semiconductor die is arranged within the first compartment, a first encapsulation material encapsulating the power semiconductor die and at least partially filling the first compartment, and a second encapsulation material different from the first encapsulation material, the second encapsulation material encapsulating the first encapsulation material and at least partially filling the second compartment, wherein the first encapsulation material is arranged within the first compartment but not within the second compartment.