Power Module Thermal Path Using Edge Metallization
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Solution Overview
Problem
Existing power modules face challenges in achieving high-power density, high-efficiency, and effective heat dissipation in space-constrained environments, particularly in high-power applications.
Innovation Solution
The power module design incorporates a substrate with a metallic coating covering the side edge and top surface, a magnetic component with wound primary and secondary windings, and a heat spreader connected to the metallic coating, providing additional heat dissipation paths through the metallic coating and thermal conductive adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the power module is reduced to improve integration, then the integration is improved, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent extends the metallic coating from the top surface to the side edge surface of the substrate, utilizing the vertical dimension for heat dissipation. This allows heat to be conducted through the side surfaces of the substrate to the heat spreader, effectively adding a dimensional pathway for thermal management in a compact form factor.
Solution Approach 2:
The metallic coating serves multiple functions: it provides electrical connection between the substrate and heat spreader, acts as a thermal conduction path, and extends the heat dissipation area to the side surfaces. This multi-functionality allows improved heat dissipation without adding separate dedicated components.
2Power
If large currents are used to achieve high power, then the power output is improved, but the thermal performance deteriorates
Solution Approach 1:
The metallic coating acts as an intermediary thermal conduction path between the substrate (where power devices generate heat) and the heat spreader. This intermediate layer provides an additional thermal pathway that facilitates heat removal from high-power devices, enabling better thermal management for high current applications.
3Temperature
If the metallic coating extends to the side edge surface, then the heat dissipation path is improved, but the manufacturing complexity increases
Solution Approach 1:
The metallic coating is integrated directly into the substrate structure, merging the electrical connection function and thermal conduction function into a single element. This integration eliminates the need for separate connection components and simplifies the manufacturing process while extending heat dissipation to the side surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation capabilities, improving thermal performance and maintaining high-power density and efficiency in compact power modules.
Implementation Method 1
The metallic coating is covered on the substrate... The heat spreader is disposed on top of the plurality of power devices... one of the at least one supporting terminals is connected to the metallic coating
Implementation Method 2
providing additional heat dissipation paths through the metallic coating and thermal conductive adhesive
Implementation Method 3
The heat spreader is disposed on top of the plurality of power devices... The design enhances heat dissipation capabilities
Data Source
AI summary
A power module for a switching circuit is provided. The power module includes a substrate, power devices, a magnetic component, a metallic coating, and a heat spreader. The magnetic component includes a magnetic core, a primary winding, and a secondary winding. The metallic coating is covered on the substrate. The metallic coating includes a first portion and a second portion, the first portion is covered on the side edge surface of the substrate, the second portion is covered on a portion of the top surface of the substrate, and the second portion is connected to the first portion. The heat spreader is disposed on top of the plurality of power devices. The heat spreader has at least one supporting terminal connected to the top surface of the substrate, and one of the at least one supporting terminals is connected to the metallic coating.