Semiconductor Power Module Embedding Substrate Electrodes
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Solution Overview
Problem
Current semiconductor power modules experience current leakage and abnormal discharge due to the top end part of substrate electrodes not being covered with insulating resin, leading to reliability issues with withstand voltage.
Innovation Solution
A semiconductor power module design featuring a concave portion on the insulating substrate to embed the substrate electrode, allowing uniform coverage of insulating resin over the top end part, preventing current leakage and enhancing voltage reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If insulating resin is applied using a potting method, then the insulating resin can be easily applied to substrate electrodes, but the top end part of the substrate electrode is not covered due to surface tension and volume contraction, causing current leakage
Solution Approach 1:
A concave portion is formed on the insulating substrate before applying the insulating resin. This preliminary structural preparation allows the resin to be contained within the concave region, preventing surface tension and volume contraction from causing exposure of the substrate electrode top end part.
Solution Approach 2:
The concave portion acts as an intermediary structure between the insulating substrate and the insulating resin. It provides a confined space that ensures complete coverage of the substrate electrode top end part with insulating resin, eliminating the coverage problem caused by resin surface tension and contraction.
2Manufacturing precision
If the substrate electrode is embedded in a concave portion, then the insulating resin can uniformly cover the top end part, but the manufacturing process becomes more complex
Solution Approach 1:
The concave portion is formed in advance on the insulating substrate, creating a predetermined structure that guides the insulating resin to uniformly cover the substrate electrode top end part. This preliminary structural preparation simplifies the resin application process and ensures consistent coverage.
Solution Approach 2:
The concave portion is localized to specific regions where substrate electrodes are positioned, rather than modifying the entire insulating substrate. This localized structural change provides the necessary coverage control while minimizing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves voltage reliability by preventing current leakage and abnormal discharge, enabling a smaller module size with better cooling performance and reduced power loss.
Implementation Method 1
substrate electrodes are covered with insulating resin and current leakage is thereby suppressed
Implementation Method 2
a thin film of polyimide-based or polyamide-imide-based insulating resin is applied to the surfaces of the substrate electrodes on a ceramic insulating substrate and hardened
Data Source
AI summary
A semiconductor power module includes: an insulating substrate including a concave portion provided on a top surface of the insulating substrate; a substrate electrode embedded in the concave portion; a semiconductor device bonded onto the substrate electrode; and an insulating resin covering a top end part of the substrate electrode.