Power Module Base Plate Features via Segmented Electrodeposition
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Solution Overview
Problem
Conventional electrochemical deposition manufacturing processes are unable to fully create electrical power modules and electronics packages with complex features such as electrical connection pillars, encapsulant retention features, and heat exchange features.
Innovation Solution
A method involving electrochemical deposition using a deposition anode array to form electrical connection pillars, encapsulant retention features, and heat exchange features on a base plate within an electrolyte solution, utilizing a power source to deposit material onto metallic layers of an electrically isolating substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional electrochemical deposition manufacturing processes are used, then parts can be manufactured with additive manufacturing capability, but complex features such as electrical connection pillars, encapsulant retention features, and heat exchange features cannot be fully created
Solution Approach 1:
The deposition anode is divided into multiple independently controllable segments or zones. Each segment can be selectively activated to deposit material in specific areas, enabling the creation of complex geometric features like electrical connection pillars, encapsulant retention features, and heat exchange features that conventional uniform deposition cannot achieve.
Solution Approach 2:
Different regions of the deposition anode are assigned different electrical potentials or current densities to create locally optimized deposition patterns. This allows precise control over material deposition in specific locations, enabling the formation of diverse complex features with varying geometries and material properties in a single manufacturing process.
2Adaptability or versatility
If conventional electrochemical deposition processes are used, then manufacturing capability is limited, but the process is simpler
Solution Approach 1:
The segmented deposition anode system serves multiple functions: it can create electrical connection pillars, encapsulant retention features, heat exchange features, and other complex geometries using a single versatile apparatus. This multi-functional capability increases adaptability while the modular segmented design keeps the system complexity manageable through standardized components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of electrical power modules and electronics packages with precise, complex features, enhancing electrical connectivity and heat dissipation capabilities.
Implementation Method 1
transmitting electrical energy from the power source through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the first metallic layer, such that material is deposited onto the first metallic layer
Implementation Method 2
This creates an electrochemical reduction reaction to occur at the cathode near the anode and deposition of material on the cathode
Data Source
AI summary
An electrical power module includes a base plate, including an electrically isolating substrate and a first metallic layer formed on a first side of the electrically isolating substrate. The electrical power module also includes electrical connection pillars extending from the first metallic layer. The electrical power module further includes at least one encapsulant retention feature extending from the first metallic layer and including at least one surface that is angled or parallel relative to the first side of the electrically isolating substrate and faces the first side of the electrically isolating substrate. The electrical power module additionally includes at least one electrical component electrically coupled with the metallic layer of the base plate. The electrical power module further includes an encapsulant encapsulating the at least one electrical component, the metallic layer, and the at least one encapsulant retention feature and partially encapsulating the electrical connection pillars.