Power Module Assembly With Embedded Isolation for Creepage Compliance
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Solution Overview
Problem
Existing power module assemblies face challenges in achieving required creepage and clearance distances for high voltage applications, particularly in space-constrained designs, due to limitations in geometry and fixation pin positioning during molding processes.
Innovation Solution
The assembly incorporates electrically isolating material to cover exposed regions of conductive structures, retracting them within the base body to meet creepage and clearance requirements, allowing for increased design freedom.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive structures are embedded in the base body with exposed regions, then electrical connectivity is achieved, but creepage and clearance distance requirements cannot be met for high voltage applications
Solution Approach 1:
The patent transitions from two-dimensional surface isolation to three-dimensional isolation by retracting conductive structures into holes within the base body and covering them with isolating material, thereby achieving creepage distance requirements without compromising design freedom
Solution Approach 2:
The patent introduces an electrically isolating material as an intermediary substance that fills the space between exposed conductive regions, effectively eliminating creepage paths and enabling high voltage isolation while maintaining manufacturing flexibility
2Manufacturing precision
If fixation pins are used to position conductive structures during molding, then manufacturing precision is achieved, but the positioning of exposed regions cannot satisfy creepage distance requirements
Solution Approach 1:
The patent performs preliminary action by retracting conductive structures into holes before the final molding process, ensuring that exposed regions are positioned within the base body geometry rather than relying solely on fixation pin positioning during molding
Solution Approach 2:
The patent embeds conductive structures within holes of the base body, creating a nested configuration where the conductive structure is contained within the isolating geometry, thereby achieving both positioning precision and creepage distance compliance
3Ease of manufacture
If exposed regions of conductive structures are left uncovered, then manufacturing simplicity is maintained, but electrical isolation standards cannot be fulfilled for high voltage applications
Solution Approach 1:
The patent merges the isolating function with the existing base body structure by integrating holes and isolating material coverage into the molding process, thereby achieving electrical isolation compliance without significantly increasing manufacturing complexity
Data Source
AI summary
An assembly for a power module includes an electrically isolating base body and first and second electrically conductive structures embedded in the base body. The first and electrically conductive structures are configured to carry different voltages during normal operation of the power module. The first and the second electrically conductive structure each comprise a first region that is not covered by the base body. The first region of the first conductive structure is arranged in a hole of the base body and is retracted with respect to an opening of the hole. The hole is filled with an electrically isolating material that covers the first region of the first conductive structure.