Power Module with Embedded Switches and Dual-Sided Heat Sink
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Solution Overview
Problem
Conventional power modules suffer from inadequate heat dissipation efficiency, complex fabrication processes, and increased parasitic inductance due to wire-bonded connections, which adversely affect switching and power conversion efficiency.
Innovation Solution
A power module design where semiconductor switches and diodes are embedded within insulation layers, with a heat sink on a substrate allowing for enhanced heat dissipation in two directions, simplifying the fabrication process and reducing parasitic inductance by eliminating wire-bonded connections between high-voltage and low-voltage switching elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonded technology is used to connect high-voltage-side and low-voltage-side switching elements, then electrical connections are established, but parasitic inductance increases and switching efficiency decreases
Solution Approach 1:
The patent removes the wire-bonding process entirely from the manufacturing method. Instead of using separate wire bonds to connect switching elements, the design uses direct substrate traces and integrated connection paths that are part of the substrate structure itself, eliminating the harmful wire bonds that cause parasitic inductance
Solution Approach 2:
The patent merges the electrical connection function with the substrate structure. The substrate serves dual purposes: as the mechanical support platform and as the electrical interconnection medium through its integrated traces and conductive paths, eliminating the need for separate wire-bonding step
2Ease of manufacture
If substrates are used to support switching elements, then components are mounted and connected, but heat dissipation is limited to single direction and efficiency is insufficient
Solution Approach 1:
The patent transitions from single-sided substrate mounting to double-sided substrate utilization. Switching elements are mounted on both the front and back surfaces of the substrate, with heat sinks attached to both sides, enabling heat dissipation in two opposite directions simultaneously and doubling the effective heat dissipation area
Solution Approach 2:
The substrate is designed to serve multiple functions simultaneously: mechanical support for components, electrical interconnection through traces, thermal conduction path to heat sinks, and structural framework for the entire module. This multi-functionality reduces the need for separate components and improves overall efficiency
3Reliability
If conventional fabrication process with separate substrate mounting is used, then components are assembled, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple manufacturing steps into a unified process. Instead of separately mounting components on different substrates and then wire-bonding them, the design integrates all mounting and connection operations into a single substrate assembly process, reducing fabrication complexity
Solution Approach 2:
The patent segments the substrate into functionally distinct regions (high-voltage side, low-voltage side, isolation zones) that can be independently designed and optimized, allowing parallel processing and simplifying the overall manufacturing workflow while maintaining component reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved heat dissipation efficiency, simplified manufacturing, and increased switching and power conversion efficiency by embedding semiconductor components within insulation layers and using a heat sink for effective thermal management.
Implementation Method 1
a heat sink on a substrate allowing for enhanced heat dissipation in two directions
Data Source
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AI summary
A power module (1, 8, 9) is disclosed including a substrate (7), a first sub-module (5), a second sub-module (6) and a circuit board (2). The semiconductor switches (50, 60) and the diodes (51, 61) of the first sub-module (5) and the second sub-module (6) are embedded within insulation layers (80). Consequently, the first sub-module (5) and the second sub-module (6) are formed as a high-voltage-side switching element and a low-voltage-side switching element of a bridge circuit. The first sub-module (5) and the second sub-module (6) are disposed on a first surface (730) of the substrate (7). An electrode (520) of the first sub-module (5) and some electrodes (620, 621) of the second sub-module (6) are electrically connected with corresponding conducting parts (21, 22, 24) of a circuit board (2). A heat sink (4) is disposed on a second surface (731) of the substrate (7).