Power Module Cooling Structure With Embedded Temperature Sensing
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Solution Overview
Problem
State-of-the-art power modules in the aeronautic field face thermal dissipation issues due to imperfections leading to temperature disparities and potential thermal runaway, with existing temperature sensing solutions being limited in adaptability, reliability, and sensitivity, and often disrupting thermal dissipation and electrical performance.
Innovation Solution
A power module design incorporating an elongated temperature sensor immersed in a metal structure formed by electrodeposition on the lower surface, which provides improved temperature detection and localization with reduced sensor count, precise measurement, and minimal impact on thermal dissipation, using optical fibers and thermocouples for enhanced sensitivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are attached onto the component or near it on the substrate, then temperature tracking is enabled, but the electrical performance of the component is impacted and reliability is reduced
Solution Approach 1:
The temperature sensor is extracted from direct contact with the component and substrate, and instead placed in direct contact with the cooling means. This separates the sensing function from the electrical components, eliminating electrical interference while maintaining temperature measurement capability.
Solution Approach 2:
The cooling means acts as an intermediary between the component and the temperature sensor. The sensor measures temperature through the cooling means, which provides a reliable thermal pathway without electrical interference, thus improving both measurement precision and system reliability.
2Measurement precision
If multiple temperature sensors are used to track all components, then temperature monitoring coverage is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The cooling means serves multiple functions: it cools the power components, provides a mounting structure for the temperature sensor, and acts as a thermal pathway for temperature measurement. This multi-functionality allows comprehensive temperature monitoring without increasing sensor quantity, thereby reducing device complexity.
Solution Approach 2:
The temperature sensing function is merged with the cooling means by placing the sensor in direct contact with it. This combination allows a single sensor to monitor temperatures of multiple components through the common cooling pathway, reducing the total number of sensors needed while maintaining comprehensive monitoring coverage.
3Measurement precision
If conventional temperature sensors are used, then temperature measurement is achieved, but sensitivity to cracking under components is insufficient
Solution Approach 1:
The cooling means serves as an intermediary that transmits mechanical stress information from the components to the temperature sensor. When cracks occur in solder joints or substrates, the stress changes are transmitted through the cooling means to the sensor, enabling detection of cracking that would be invisible to conventional sensors placed elsewhere.
Solution Approach 2:
The patent replaces conventional mechanical mounting methods with a thermal field-based sensing approach. By using the cooling means as both a thermal pathway and a stress transmission medium, the system detects mechanical failures (cracks) through temperature field changes, providing enhanced sensitivity to structural integrity issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for precise temperature tracking and localization across multiple components with reduced thermal resistance and mechanical stress, improving reliability and adaptability while maintaining effective thermal dissipation and electrical performance.
Implementation Method 1
the metal structure is formed by electrodeposition on the lower surface and the elongated sensor
Implementation Method 2
The thermal and mechanical contact between the substrate or the baseplate and the optical fiber is thus continuous
Implementation Method 3
using optical fibers and thermocouples for enhanced sensitivity and reliability
Data Source
AI summary
A power module includes a plurality of semiconductor-based power components and a substrate having an upper metallization receiving the components and a lower metallization opposite to the upper metallization. Optionally, a baseplate may be fixed to the lower metallization of the substrate. A metal structure is in direct contact with a lower surface defined by the either optional baseplate or the substrate, on the side opposite the components. The power module includes at least one elongated temperature sensor, at least partially immersed in the metal structure and spreading parallel to the lower surface.