Power Module Thermal Sensing via Embedded Underside Sensor
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Solution Overview
Problem
Existing power modules in the aeronautical field face issues with thermal disparities and cracking due to imperfections in semiconductor components, leading to potential thermal runaway and failure, which are not effectively addressed by integrated temperature sensors that impact electrical performance and are costly for customization.
Innovation Solution
A power module design incorporating elongated temperature sensors embedded in a metal structure, formed by electrodeposition, which extends parallel to the substrate or sole, allowing precise temperature monitoring and localization of thermal problems without disrupting heat dissipation or module operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If temperature sensors are integrated directly into semiconductor components, then temperature monitoring capability is improved, but the number of available components is reduced and customization possibilities are greatly reduced leading to high prices
Solution Approach 1:
The temperature sensor is extracted from the semiconductor component itself and placed in a separate location (substrate or housing) where it can monitor temperature without being integrated into the component structure. This allows standard semiconductor components to be used while still providing temperature monitoring capability.
Solution Approach 2:
An intermediary structure (substrate or housing with embedded sensor) is introduced to monitor temperature indirectly. The sensor monitors the temperature of the substrate or housing which reflects the thermal state of the semiconductor components, allowing temperature monitoring without direct integration into the components.
2Measurement precision
If temperature sensors are attached to the component or near it on the substrate, then temperature monitoring is enabled, but electrical performance of the component is impacted and reliability during thermal cycling is limited
Solution Approach 1:
The sensor is extracted from direct contact with the component and its immediate vicinity, and placed in the substrate or housing instead. This separation eliminates the impact on electrical performance while maintaining temperature monitoring capability through thermal coupling to the substrate.
Solution Approach 2:
The substrate or housing serves as an intermediary that thermally couples the sensor to the semiconductor components while providing mechanical and electrical isolation. This intermediary structure protects the sensor from direct thermal cycling stresses on the components.
3Measurement precision
If multiple temperature sensors are used to monitor all components, then comprehensive temperature monitoring is achieved, but the number of sensors required increases complexity and cost
Solution Approach 1:
A single temperature sensor in the substrate or housing provides universal temperature monitoring for multiple semiconductor components simultaneously. The sensor measures the overall thermal state of the module, which reflects the temperature of all thermally coupled components.
Solution Approach 2:
Multiple temperature monitoring functions are merged into a single sensor location. Instead of having separate sensors for each component, one sensor in the substrate or housing provides integrated temperature information for the entire module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded sensors provide accurate temperature measurement and improved detection of thermal issues, reducing the number of sensors needed and minimizing their impact on heat dissipation, while ensuring reliable and reproducible temperature monitoring with reduced mechanical stress on the optical fiber.
Implementation Method 1
the metal structure is formed by electrodeposition on the underside
Implementation Method 2
Each elongated sensor may comprise an optical fiber, and in particular is a Bragg grating fiber optic sensor or a Rayleigh backscattering fiber optic sensor
Implementation Method 3
Each elongated sensor can include at least one thermocouple
Implementation Method 4
a radiator 23 is fixed to a lower face 24 of the sole 19, to the lower face 9, by means of a layer of thermal interface material 25
Implementation Method 5
In order to have satisfactory heat dissipation for the power module 1
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to a power module (31) comprising: - a plurality of semiconductor power components (37); - a substrate (33) comprising an upper metallization (45) that receives the components (37) and a lower metallization (47) opposite the upper metallization (45); - optionally, a base plate (49) attached to the lower metallization (47) of the substrate (33); - a metal structure (56) in direct contact with a lower face (54) defined by the base plate (49) or the substrate (33), on a side opposite the components (37); and - at least one elongate temperature sensor (58), at least partially embedded in the metal structure (56) and extending in parallel with the lower face (54).