Power Module Embedding in Dielectric Concavities
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Solution Overview
Problem
The challenge is to reduce the volume and weight of power modules in personal mobility vehicles while maintaining effective heat dissipation and preventing increased thermal resistance and electrical impedance, which is typically achieved by integrating a power module and electric vehicle motor, but existing designs struggle with inconsistent power element thicknesses and coefficient of thermal expansion mismatches.
Innovation Solution
The power module embeds power elements in concavities of a dielectric layer with metal layers on both surfaces, allowing for even placement and electrical connection without wire bonding, and incorporates dual-sided heat dissipation devices for enhanced thermal management, reducing the need for additional spacers and minimizing volume and weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power elements are integrated into the power module, then the volume and weight are reduced, but the heat dissipation ability deteriorates
Solution Approach 1:
The patent transitions from single-sided to dual-sided mounting of power elements on the substrate. By utilizing both surfaces of the substrate for mounting power elements and incorporating heat dissipation structures on both sides, the design effectively adds a dimensional aspect to heat dissipation, thereby improving thermal management while maintaining compact size.
Solution Approach 2:
The patent divides the heat dissipation function into multiple independent components: substrate, heat dissipation plate, and heat dissipation fins. This segmentation allows each component to specialize in specific thermal management tasks, improving overall heat dissipation efficiency without increasing the module's volume.
2Adaptability or versatility
If power elements with different thicknesses are used, then design flexibility is improved, but manufacturing precision deteriorates
Solution Approach 1:
The substrate incorporates localized concave structures at specific mounting positions to accommodate power elements of different thicknesses. This local adaptation allows the use of power elements with varying thickness requirements while maintaining a flat overall surface, thus preserving both design flexibility and manufacturing precision.
3Manufacturing precision
If additional spacers are added to compensate for thickness differences, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The patent integrates the thickness compensation function directly into the substrate structure through concave formations, merging the substrate's structural support role with the thickness adjustment function. This eliminates the need for separate spacer components, reducing device complexity while maintaining manufacturing precision.
4Reliability
If wire bonding is used for electrical connection, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the electrical connection system. Instead, it utilizes direct metallurgical bonding through the substrate's metal layers to establish electrical connections between power elements, thereby simplifying the device structure while maintaining reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the power module's volume and weight, enhances heat dissipation, lowers power loss, and prevents damage from thermal expansion mismatches, while maintaining efficient electrical connectivity and thermal management.
Implementation Method 1
The first dielectric layer has at least two concavities... Two power elements are respectively embedded in two concavities of the first dielectric layer... preventing increased thermal resistance
Implementation Method 2
The two first metal layers are respectively disposed on the two surfaces... Two power elements are electrically connected to each other through the conductive structure
Implementation Method 3
incorporates dual-sided heat dissipation devices for enhanced thermal management... enhancing heat dissipation
Implementation Method 4
prevents damage from thermal expansion mismatches... minimizing volume and weight
Data Source
AI summary
A power module includes a first substrate, at least two power elements, at least one conductive structure and at least one leadframe. The first substrate includes a first dielectric layer and two first metal layers. The first dielectric layer has at least two concavities and two opposite surfaces, the two first metal layers are respectively disposed on the two surfaces, and the two concavities are respectively formed on the two surfaces. The two power elements are respectively embedded in the two concavities of the first dielectric layer. The two power elements are electrically connected to each other through the conductive structure. The leadframe disposed at the first substrate is electrically connected to the two power elements, and is partially extended outside the first substrate.