Power Module Substrate Layout for Heat Dissipation and EMI Isolation
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Solution Overview
Problem
The challenge of heat dissipation and electromagnetic interference in high-density power modules, particularly in surface-mounted components, hinders efficient performance and safety in electronic assemblies.
Innovation Solution
A power module design with a multi-layer substrate structure, incorporating insulating dielectric layers and metal via holes, allows for efficient heat transfer and electrical insulation, using a heat sink mounted away from the power component to prevent electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If surface-mount technology is used to increase power density, then assembly density and reliability are improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by placing the heat sink on the opposite side of the substrate from the power component. This vertical arrangement utilizes the thickness dimension of the substrate to create an efficient heat conduction path, allowing heat to travel directly from the power component through the substrate to the heat sink without occupying additional lateral space.
Solution Approach 2:
The substrate serves as a thermal intermediary between the power component and the heat sink. By using the substrate's conductive layers and dielectric layers as heat transfer pathways, the patent creates an efficient thermal coupling that maintains electrical isolation while enabling effective heat dissipation from the surface-mounted power component.
2Temperature
If heat sink is placed close to power component for heat dissipation, then heat dissipation efficiency is improved, but electromagnetic interference occurs due to heat sink carrying electricity
Solution Approach 1:
The dielectric layer acts as an intermediary that simultaneously provides electrical insulation and thermal conduction. This layer is positioned between the power component and the heat sink, blocking electrical current paths that would cause electromagnetic interference while maintaining thermal coupling for efficient heat dissipation. The dielectric material's properties allow it to conduct heat while preventing electrical conduction.
Solution Approach 2:
The patent separates the power component and heat sink to opposite sides of the substrate in the vertical dimension, eliminating the need for the heat sink to carry electrical current in the horizontal plane. This spatial arrangement in the thickness direction of the substrate prevents electromagnetic interference while maintaining thermal efficiency through the substrate's conductive pathways.
3Temperature
If heat sink volume is increased to improve heat dissipation, then heat exchange area is improved, but space utilization is reduced
Solution Approach 1:
The patent utilizes the vertical dimension (thickness direction) of the substrate to position the heat sink, allowing it to extend in the vertical direction rather than occupying excessive lateral space. This three-dimensional arrangement enables a large heat exchange area while maintaining compact planar dimensions, effectively using the Z-axis to resolve the space constraint.
Solution Approach 2:
The heat sink is segmented into multiple sections that can be distributed across the substrate surface, with each section optimized for specific heat dissipation requirements. This segmentation allows the heat sink to maximize its heat exchange area within the available vertical space while maintaining efficient thermal coupling with the power component through the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high heat dissipation efficiency and reduces electromagnetic interference, enabling compact size and improved power density while ensuring reliable operation.
Implementation Method 1
Heat generated by the power component may be transferred to the heat sink by using the substrate, and then the heat sink transfers the heat to the outside through heat exchange
Implementation Method 2
an insulating dielectric layer is disposed between any two adjacent conductive layers... the insulating dielectric layer in the substrate can be used to isolate the second conductive layer from another conductive layer, to prevent the heat sink from carrying electricity
Data Source
AI summary
A power module and a charging device. The power module includes a substrate, a power component, and a heat sink. The substrate includes at least two conductive layers, the at least two conductive layers are stacked along a thickness direction of the substrate, and an insulating dielectric layer is disposed between any two adjacent conductive layers. The at least two conductive layers include a first conductive layer and a second conductive layer, and the first conductive layer and the second conductive layer are respectively located on two surfaces in the thickness direction of the substrate. The power component is disposed on a surface that is of the first conductive layer and that is away from the second conductive layer, and the heat sink is disposed on a surface that is of the second conductive layer and that is away from the first conductive layer.