Power Module Encapsulation Layout for Stable Magnetic Components
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Solution Overview
Problem
Conventional power modules experience increased power loss and parameter changes in magnetic components due to stress generated during encapsulation, leading to instability and inefficiency.
Innovation Solution
A power module design that misaligns the encapsulation layer with the magnetic component, creating gaps greater than or equal to 0.2 mm to prevent stress-induced changes, while using copper blocks for enhanced heat dissipation and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the magnetic component is completely encapsulated in the encapsulation material, then the structural protection and integration are improved, but the stress generated during encapsulation causes increased power loss and parameter changes in the magnetic component
Solution Approach 1:
The encapsulation is divided into two distinct parts: a first encapsulation layer that completely covers the magnetic component for protection, and a second encapsulation layer that covers other components but deliberately excludes the magnetic component. This segmentation allows the magnetic component to be protected from mechanical damage while avoiding stress-induced performance degradation.
Solution Approach 2:
Different encapsulation strategies are applied to different regions of the power module. The magnetic component receives full encapsulation for structural protection, while other areas receive selective encapsulation. This local differentiation optimizes both protection and performance by applying encapsulation only where beneficial.
2Stability of the object's composition
If the magnetic component is completely encapsulated, then the integration and protection are improved, but the stress from encapsulation material causes parameter changes and instability
Solution Approach 1:
The encapsulation structure is segmented into two layers with different functions. The first encapsulation layer provides structural stability by completely covering the magnetic component, while the second encapsulation layer provides environmental protection to other components without imposing stress on the magnetic component.
Solution Approach 2:
The patent applies different encapsulation qualities to different components based on their specific requirements. The magnetic component receives full encapsulation for structural stability, while other components receive selective encapsulation that avoids stress-related parameter changes.
3Ease of manufacture
If conventional encapsulation is used, then the manufacturing process is simple, but the power loss increases and magnetic component parameters change
Solution Approach 1:
The manufacturing process is segmented into distinct steps: forming the first encapsulation layer around the magnetic component, assembling remaining components, and then forming the second encapsulation layer around excluded components. This segmented approach maintains manufacturing simplicity while eliminating the power loss issue through selective encapsulation.
Data Source
AI summary
The present disclosure provides a power module including a substrate, a first electronic component, at least one metal component, a first metal connection portion, and a second metal connection portion. The first electronic component and the at least one metal component are disposed at the first side of the substrate. The first metal connection portion and the second metal connection portion are disposed at a second side of the substrate. The first metal connection portion is electrically connected to the first electronic component to form an input and/or output pin of the power module. The second metal connection portion is at least electrically connected to the substrate to form a signal pin of the power module. The first side and the second side are opposite to each other.