Rotationally Symmetric Power Module Layout for Flexible Connections
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Solution Overview
Problem
Existing semiconductor devices with multiple modules have limited flexibility in arranging semiconductor modules due to fixed connection methods, restricting the degree of freedom in module arrangement and necessitating additional wiring for external connections.
Innovation Solution
A semiconductor device comprising multiple modules with rotationally symmetric planar shape and strategically positioned main electrodes, allowing for flexible arrangement and direct connection to external circuits without additional wiring through pins and screws.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor modules are connected with fixed connection methods (collector main electrode to emitter main electrode), then the connection structure is simple, but the degree of freedom in module arrangement is limited
Solution Approach 1:
The patent applies universality by making each semiconductor module's main electrodes (both collector and emitter) capable of serving dual purposes: internal connection within the module and external connection to other modules or circuits. Each module is designed with both collector main electrodes and emitter main electrodes that can function as either input or output terminals, allowing the same module structure to be connected in various configurations (series, parallel, or mixed) without requiring different module designs.
Solution Approach 2:
The patent segments the power control function into multiple independent semiconductor modules, each capable of operating autonomously with its own set of main electrodes. This segmentation allows each module to be independently arranged and connected, providing flexibility in system configuration while maintaining modular simplicity.
2Adaptability or versatility
If additional wiring is used to connect main electrodes to external circuits, then connection flexibility is improved, but device complexity and inductance increase
Solution Approach 1:
The main electrodes serve multiple functions: they act as both internal connection terminals within the semiconductor module and as external connection terminals to other modules or circuits. This eliminates the need for separate additional wiring, as the same electrodes handle both internal and external connections, thereby reducing overall wiring complexity and inductance.
Solution Approach 2:
The patent merges the internal connection function and external connection function into the same main electrode structures. Instead of having separate internal bonding wires and external terminal connections, the main electrodes directly serve both purposes, combining multiple functions into a single structural element to reduce complexity.
3Ease of manufacture
If semiconductor modules are designed with fixed electrode positions, then manufacturing is simplified, but arrangement flexibility is reduced
Solution Approach 1:
The patent employs asymmetric design in the electrode positioning within each semiconductor module. The collector main electrodes and emitter main electrodes are positioned at different locations on the module, creating an asymmetric configuration. However, this asymmetry is designed such that each module type can be rotated or repositioned to achieve different connection configurations, thereby maintaining manufacturing simplicity while enabling arrangement flexibility.
Solution Approach 2:
The patent allows for inversion of connection configurations by enabling modules to be connected in opposite orientations. The same module design can be arranged with collector-to-emitter connections or emitter-to-collector connections by simply changing the orientation, effectively using the inverted configuration to achieve different electrical connections without redesigning the module.
Data Source
AI summary
A semiconductor device includes a plurality of semiconductor modules. Each of the plurality of semiconductor modules includes: a base plate having a first surface and a second surface, the first surface being exposed to the outside of the semiconductor module, the second surface being on a side opposite to the first surface; an insulated substrate with a circuit pattern provided thereon; a semiconductor chip bonded to the circuit pattern; a sealer that seals the insulated substrate and the semiconductor chip; and a first main electrode and a second main electrode drawn out of the sealer in a direction opposite to a direction from the sealer toward the base plate. The semiconductor module has a planar shape with four corners, and has a rotationally symmetric shape.