Semiconductor Power Module Flexible Contact Pin

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Solution Overview

Problem

Semiconductor power modules face a higher error rate due to soldered connections, which are prone to mechanical loading issues such as oscillations, shocks, and thermal stresses, leading to potential electrical failures.

Innovation Solution

A semiconductor power module design featuring a contact pin mechanically fixed and electrically connected to a carrier plate via a soldering point, with an additional flexible connection that decouples from mechanical loading, ensuring continuous electrical contact even if the soldering point fails, and can be either directly or indirectly fixed using a sleeve or a foot.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If contact pins are connected to the carrier plate by means of soldering points, then electrical connection is achieved, but the error rate increases due to susceptibility to mechanical loading

Engineering Contradiction:

Improveerror rateVSAvoidmechanical loading susceptibility

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A flexible connection element is introduced as an intermediary between the contact pin and the carrier plate. This flexible connection serves as a mediator that transmits electrical signals while isolating the brittle soldering point from mechanical stresses such as oscillations, shocks, and thermal expansion, thereby reducing the error rate without compromising electrical connectivity

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the direct mechanical-soldered connection with a flexible connection that has mechanical compliance. This substitution allows the system to maintain electrical connection while avoiding the transmission of mechanical loads to the soldering point, effectively decoupling the electrical function from mechanical stress

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If a direct soldered connection is used between contact pin and carrier plate, then structural simplicity is maintained, but reliability decreases under mechanical stress

Engineering Contradiction:

Improveconnection reliabilityVSAvoidconnection structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The connection between the contact pin and carrier plate is segmented into two distinct functional parts: a soldering point for electrical connection and a flexible connection element for mechanical compliance. This segmentation allows each component to optimize its specific function - the soldering point provides reliable electrical contact while the flexible connection absorbs mechanical stresses, thereby improving overall connection reliability without excessive complexity

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If soldering points are used to fix contact pins, then manufacturing process is simple, but the connection fails under oscillations and thermal stresses

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidresistance to oscillations and thermal stresses

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent employs a flexible connection element that can be a thin film or flexible structure designed to accommodate oscillations and thermal stresses. This flexible component maintains electrical connectivity while physically isolating the soldering point from dynamic mechanical loads and thermal expansion forces, thereby improving resistance to oscillations and thermal stresses without significantly complicating the manufacturing process

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The flexible connection ensures reliable electrical contact and reduces the risk of electrical failure under mechanical loading, maintaining operational integrity by decoupling from mechanical stress and potentially replacing the soldering point connection.

Implementation Method 1

the contact pin is arranged above a soldering point, wherein the soldering point is configured to mechanically directly or indirectly fix the contact pin on the carrier plate and to electrically connect said contact pin to the carrier plate

Methodology Applied

Scientific EffectSoldering: Soldering

Implementation Method 2

the further connection has a portion which is mechanically flexible in relation to the carrier plate

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS11316292B2Semiconductor power module and method for producing a semiconductor power module

Publication Date: 2022.04.26 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor power module includes an electrically conductive carrier plate, a power semiconductor chip arranged on the carrier plate and electrically connected to the carrier plate, and a contact pin electrically connected to the carrier plate and forming an outer contact of the semiconductor power module. The contact pin is arranged above a soldering point. The soldering point is configured to mechanically directly or indirectly fix the contact pin on the carrier plate and to electrically connect the contact pin to the carrier plate. The contact pin is electrically connected to the carrier plate via a further connection. The further connection has a portion which is mechanically flexible in relation to the carrier plate.