Power Module Assembly With Form-Fit Thermal Coupling
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Solution Overview
Problem
Conventional power modules face challenges in accurate positioning of electronic components due to non-uniform weight distribution, leading to poor thermal conductivity and heat dissipation, which affects the performance and cooling of high-performance semiconductor devices.
Innovation Solution
A power module design featuring a chip arrangement with a carrier and electronic components, a heat sink with conductive and insulating layers, and an arrangement body providing form fits between the chip arrangement and the heat sink, ensuring accurate thermal coupling and stable positioning, even with non-uniform weight distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the chip arrangement is positioned accurately on the heat sink, then the positioning precision is improved, but the thermal conductivity between the chip arrangement and heat sink deteriorates
Solution Approach 1:
The patent introduces an arrangement body as an intermediary component between the chip arrangement and heat sink. This arrangement body includes a support portion that contacts the heat sink and a contact portion that receives the chip arrangement. By positioning the arrangement body at a distance from the heat sink surface rather than directly bonding the chip arrangement to the heat sink, the patent achieves both accurate positioning and maintained thermal conductivity through the arrangement body's thermal pathways.
2Adaptability or versatility
If the electronic components are arranged on the carrier with non-uniform weight distribution, then the design flexibility is improved, but the positioning accuracy deteriorates due to carrier tilting
Solution Approach 1:
The arrangement body serves as a mediator that decouples the chip arrangement from direct contact with the heat sink. The support portion of the arrangement body contacts the heat sink while the contact portion receives the chip arrangement. This intermediary structure prevents carrier tilting caused by non-uniform weight distribution from affecting positioning accuracy, as the arrangement body absorbs and compensates for the weight distribution variations.
Solution Approach 2:
The patent segments the positioning function into two separate portions: the support portion that interfaces with the heat sink and the contact portion that interfaces with the chip arrangement. This segmentation allows each portion to be optimized independently - the support portion ensures stable positioning on the heat sink while the contact portion accommodates the chip arrangement with its non-uniform weight distribution, thereby maintaining overall positioning accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables easy, accurate, and rapid assembly of power modules, enhancing thermal coupling and heat dissipation, thus improving the performance and cooling of electronic components.
Implementation Method 1
the chip arrangement is thermally coupled to the heat sink through the arrangement body
Data Source
AI summary
A power module (20) includes: a chip arrangement (24) with a carrier (40) and at least one electronic component (42) assembled on the carrier (40); a heat sink (22)) with a first layer (30), an electrically insulating second layer (32) located on the first layer (30), and an electrically conductive third layer (34) located on the second layer (32); and an arrangement body (26) arranged between the chip arrangement (24) and the heat sink (22), with at least one contact recess (50, 52) through which the chip arrangement (24) is thermally coupled to the heat sink (22), and formed and arranged such that a form fit is provided between the arrangement body (26) and the heat sink (22) in a direction extending parallel to at least one of the layers (30, 32, 34) of the heat sink (22) and between the arrangement body (26) and the chip arrangement (24) in a direction extending parallel to the carrier (40) of the chip arrangement (24).