Power Module Frame Adjusting Cooling Member Distance
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Solution Overview
Problem
Conventional power modules face challenges in maintaining dimensional tolerance during the molding process, leading to resin leakage and potential breakage of semiconductor elements due to inadequate holding and pressure issues.
Innovation Solution
Incorporating a frame member with an adjusting mechanism between cooling members to adjust the distance between them, using spring members or block members that can expand or contract to match the intended dimensions, and employing a molding die with pressing pins to ensure proper alignment and pressure distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the resin is supplied into the molding area between cooling members, then the semiconductor element can be sealed and cooled, but the resin may leak from the molding die due to dimensional tolerance issues
Solution Approach 1:
The frame member is pre-assembled with the semiconductor element and cooling members before the molding process. This preliminary assembly establishes precise dimensional relationships and positioning, ensuring that when resin is subsequently supplied, it remains within tolerance limits and prevents leakage while maintaining reliable sealing.
2Reliability
If the molding pressure is applied to seal the semiconductor element, then the sealing is improved, but the semiconductor element or solder may be broken due to inadequate holding
Solution Approach 1:
The frame member serves as a cushioning structure that absorbs and distributes molding pressure uniformly across the semiconductor element and solder joints. This pre-positioned support prevents concentration of stress that could cause breakage, while still allowing the resin to achieve proper sealing under the distributed pressure.
3Ease of manufacture
If the distance between cooling members is not precisely controlled, then the manufacturing process is simpler, but resin leakage and element breakage occur
Solution Approach 1:
The frame member acts as an intermediary structure between the cooling members, providing a rigid reference framework that precisely controls the distance between cooling members. This intermediary element simplifies manufacturing by providing built-in dimensional references, eliminating the need for complex measurement and adjustment procedures while ensuring consistent spacing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise dimensional management, preventing resin leakage and semiconductor breakage, while allowing for efficient molding without excess resin injection or removal, and enhances heat transfer performance.
Implementation Method 1
a distance between the first cooling member and the second cooling member is adjusted by expansion or contraction of the elastic member to an intended distance
Implementation Method 2
the elastic member is expanded by the first metal block which is being pressed by the second pressing pin, and by the second metal block which is being pressed by the first pressing pin during the molding process
Data Source
AI summary
A power module is disclosed that includes a semiconductor element, a first cooling member and a second cooling member configured to sandwich the semiconductor element therebetween, a frame member configured to support the semiconductor element between the first cooling member and the second cooling member and molded resin disposed between the first cooling member and the second cooling member, wherein the frame member includes an adjusting member which adjusts a distance between the first cooling member and the second cooling member.