Power Module Frame Body and Heat Radiation Member Design
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Solution Overview
Problem
The existing power module structure, which uses adhesive to attach the bottom case, top case, and side case, lacks rigidity and durability, leading to concerns about deformation and mechanical stability when fixed to the housing of the power conversion apparatus.
Innovation Solution
A power module design featuring a metallic frame body with a heat radiation member and a heat radiation fin unit, where the heat radiation member has a higher conductivity than the frame body, and the frame body is more rigid, with a joint portion at the external peripheral edge, and the heat sinks are arranged to face each other with a fin peripheral edge unit to enhance heat radiation and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is used to attach the bottom case, top case, and side case, then the assembly process is simplified, but the rigidity and durability of the power module deteriorate
Solution Approach 1:
The power module structure is segmented into distinct functional components: a frame body for mechanical support and rigidity, heat sinks for thermal management, and a case for protection. This segmentation allows each component to be optimized for its specific function while being joined through robust mechanical connections rather than adhesive bonding alone.
Solution Approach 2:
The power module employs composite construction combining different materials with complementary properties: aluminum or aluminum alloy for the frame body and heat sinks to provide both structural integrity and thermal conductivity, and adhesive materials selected for their high strength and temperature resistance to supplement the mechanical joints.
2Temperature
If a metallic frame body with heat radiation member is used, then the heat radiation performance is improved, but the device complexity increases
Solution Approach 1:
The frame body serves multiple functions simultaneously: it provides the structural framework for the power module, acts as a heat conduction path from the semiconductor devices, and supports the heat sinks. The heat sinks similarly serve both thermal management and structural support functions, reducing the need for separate components.
Solution Approach 2:
The frame body and heat sinks are integrated into a unified thermal management system where the frame body serves as both structural support and heat conduction element. The heat sinks are directly coupled to the frame body, merging the mechanical support function with the thermal management function into a single integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high rigidity and heat radiation performance, improving the durability and mechanical stability of the power module and power conversion apparatus, while efficiently transferring heat to the coolant in the cooling channel.
Implementation Method 1
the heat radiation member has a heat conductivity higher than that of the frame body
Implementation Method 2
heat radiation fin unit having a plurality of heat radiation fins vertically arranged thereon
Implementation Method 3
cooling the power module by way of radiation fins provided at both sides
Data Source
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AI summary
A power module includes a plurality of semiconductor devices constituting upper/lower arms of an inverter circuit, a plurality of conductive plates arranged to face electrode surfaces of the semiconductor devices and a module case configured to accommodate the semiconductor devices and the conductive plates, wherein the module case includes a heat radiation member made of plate-like metal and facing a surface of the conductive plate and a metallic frame body having an opening portion that is closed by the heat radiation member, and wherein a heat radiation fin unit having a plurality of heat radiation fins vertically arranged thereon is provided at a center of the heat radiation member, and a joint portion with the frame body is provided at an external peripheral edge of the heat radiation member, and the heat radiation member has a heat conductivity higher than that of the frame body, and the frame body is of a higher rigidity than that of the heat radiation member.