Power Module for Medium Voltage Frequency Converter

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Solution Overview

Problem

Existing power modules for medium and high-voltage frequency converters are inefficient due to non-compact structure and inadequate cooling, leading to spurious emission interference and reduced reliability.

Innovation Solution

A power module design with a circuit board mounting a rectifying module, capacitor bank, and inverting module, along with a control board, which includes capacitors welded on the board for efficient cooling and reduced interference, and a supporting structure for enhanced reliability and compactness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If multiple power modules are connected in series to regulate power in medium and high-voltage frequency converters, then the power conversion capability is improved, but the system structure becomes complex and the cooling efficiency deteriorates

Engineering Contradiction:
Improvepower conversion capabilityVSAvoidsystem structure complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent combines the rectifying module, capacitor bank, and inverting module onto a single circuit board, merging multiple functional modules into one integrated power module. This reduces the number of separate components that need to be connected in series, thereby simplifying the overall system structure while maintaining the power conversion capability through the integrated design of these modules.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuit board serves multiple functions simultaneously: it provides electrical connections for power conversion, structural support for mounting various modules, and a platform for integrating the rectifying module, capacitor bank, and inverting module. This multi-functionality reduces the need for separate structural components, simplifying the system structure.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Volume of moving object

If the power module structure is compacted to make the system more compact, then the space utilization is improved, but the cooling efficiency deteriorates

Engineering Contradiction:
Improvepower module volumeVSAvoidcooling efficiency
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent utilizes the vertical dimension by having capacitors in the capacitor bank stand upright on the circuit board rather than lying flat. This vertical arrangement optimizes the use of three-dimensional space, allowing for better air circulation and heat dissipation paths while maintaining a compact overall footprint of the power module.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent provides localized cooling considerations by arranging components and designing the housing with specific recesses and airflow paths tailored to the thermal characteristics of each module. The housing includes a recess at the rear end to facilitate air flow, and components are positioned to optimize local heat dissipation while maintaining overall compactness.

Inventive Principle:
Principle #3Local quality

3Device complexity

If components are mounted on a common circuit board to simplify structure, then the device complexity is reduced, but the reliability deteriorates due to potential interference and cooling issues

Engineering Contradiction:
Improvestructural complexityVSAvoidmodule reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The circuit board acts as an intermediary platform that provides structured mounting and electrical connections while the housing serves as another intermediary that provides mechanical support, protection, and optimized airflow paths. These intermediary structures enable the close integration of modules while maintaining reliability through proper mechanical support and thermal management.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the mounting parameters of capacitors from horizontal to vertical orientation, and optimizes the airflow parameters through housing design with recesses. These parameter changes improve both the electrical performance and thermal management of the integrated modules, thereby enhancing reliability while maintaining structural simplicity.

Inventive Principle:
Principle #35Parameter changes

4Manufacturing precision

If capacitors are welded on the circuit board for compact integration, then the manufacturing precision is improved, but the reliability deteriorates due to potential welding defects

Engineering Contradiction:
Improvecomponent mounting precisionVSAvoidwelding reliability
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The welding process serves dual purposes: it provides precise mechanical mounting of capacitors to the circuit board while simultaneously creating reliable electrical connections. The design leverages the welding joint itself to achieve both positioning and electrical connectivity, eliminating the need for separate mounting and connection operations, thereby maintaining precision while enhancing reliability through the robustness of welded joints.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS10707768B2Power module for medium and high-voltage frequency converter and frequency converter comprising same
Publication Date: 2020.07.07 ABB (SCHWEIZ) AG
  • US10707768B2 patent drawing
  • US10707768B2 patent drawing
  • US10707768B2 patent drawing

AI summary

A power module for medium and high-voltage frequency converter and a frequency converter comprising same. The power module has a three-phase alternating current input and a single-phase alternating current output, and comprises a circuit board (100), a rectifying module (120), a capacitor bank (130), and an inverting module (140), wherein the rectifying module, the capacitor bank and the inverting module are all mounted on the circuit board. The power module has a compact structure and is convenient to cool.