Power Module Interface Sealing Against Corrosive Gas Ingress

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Solution Overview

Problem

Power modules face reliability issues due to corrosion from corrosive gases like hydrogen sulfide, which can damage electronic components and reduce module reliability, especially in harsh environments such as the rubber industry and mining applications.

Innovation Solution

A gas flow-inhibiting sealing is implemented at the interface between the module and the printed circuit board, using a deformable material with sacrificial particles to prevent corrosive gases from entering the module, ensuring a gas-tight connection and protecting the electronic components from corrosion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a gas flow-inhibiting sealing is implemented at the module interface, then reliability is improved by preventing corrosive gas ingress, but device complexity increases due to the additional sealing component and assembly steps

Engineering Contradiction:
Improvemodule reliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sealing is pre-integrated into the module housing structure before final assembly, creating a ready-to-seal interface that reduces assembly complexity while maintaining reliability benefits

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The sealing combines multiple material properties (deformability for sealing, gas flow inhibition characteristics for protection) into a single integrated component that addresses both sealing and gas barrier requirements simultaneously

Inventive Principle:
Principle #40Composite materials

2Reliability

If a deformable sealing material is used to ensure gas-tight connection, then reliability is improved by adapting to interface variations, but manufacturing precision becomes more difficult to control due to material variability

Engineering Contradiction:
Improvegas-tight connectionVSAvoidsealing consistency
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The sealing material's deformability parameter is optimized to provide sufficient compliance for interface adaptation while maintaining consistent sealing pressure and gas barrier properties across production batches

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The sealing acts as an intermediary element that compensates for interface variations between module and mounting base, absorbing dimensional tolerances and surface irregularities to ensure consistent gas-tight connections

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly improves the electric and mechanical reliability of the module by preventing corrosive gas ingress, reducing convection, and protecting electronic components from corrosion, thereby enhancing the module's performance in harsh environments.

Implementation Method 1

convection may be stopped or strongly reduced by the gas flow-inhibiting sealing

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

Gas diffusion through the sealing may be eliminated, suppressed or may still happen

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 3

the properties of the material of the sealing in combination with a deformability of the sealing may ensure a substantially gas flow-tight connection

Methodology Applied
Scientific EffectDeformation: Deformation

Data Source

PatentEP3886155B1Module with gas flow-inhibiting sealing at module interface to mounting base
Publication Date: 2025.01.01 INFINEON TECHNOLOGIES AG
  • EP3886155B1 patent drawingFigure 1~4
  • EP3886155B1 patent drawingFigure 5~9

AI summary

A module (100) which comprises an electronic component (102), an enclosure (104) at least partially enclosing the electronic component (102) and defining a module interface (106) at which the module (100) is to be mounted on a mounting base (152), and a gas flow-inhibiting, in particular gas flow-tight, sealing (108) at the module interface (106) configured for inhibiting gas from propagating from an exterior of the module (100) towards the electronic component (102) .