Power Module Bridge Gel Encapsulation for Crack Resistance
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Solution Overview
Problem
Existing power module bridges encase power modules with molding compounds that are prone to cracking, leading to reduced durability and reliability.
Innovation Solution
A power module bridge design that integrates power modules without a molded body, using a frame filled with silicone gel to provide protection and thermal management, eliminating the need for a rigid encasement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power modules are encased with molding compound, then the power module is protected and enclosed, but the encasement is prone to cracking and reduces reliability
Solution Approach 1:
The patent changes the physical state and material properties of the protective medium from rigid molding compound to viscous silicone gel. This parameter change allows the protective material to remain flexible and crack-resistant while still providing protection, directly resolving the contradiction between protection and crack resistance
Solution Approach 2:
The patent uses a composite structure combining silicone gel with a housing, creating a hybrid protective system. The silicone gel provides flexibility and crack resistance, while the housing provides structural protection, together achieving both protection and durability without the cracking issues of pure molding compound encasement
2Strength
If rigid encasement with molding compound is used, then structural protection is provided, but mechanical stress and thermal fatigue increase
Solution Approach 1:
The patent transforms the protective material from rigid to viscous state, fundamentally changing its mechanical properties. The viscous silicone gel can deform and absorb mechanical stress rather than transmitting it, reducing thermal fatigue while maintaining structural protection through the combination of gel and housing
3Reliability
If molding compound encasement is used, then the power module is enclosed, but heat dissipation is reduced
Solution Approach 1:
The patent changes the thermal conductivity parameter of the protective medium by using silicone gel instead of molding compound. The viscous gel material has superior thermal dissipation properties compared to rigid plastic, allowing heat to be conducted away from the power module more effectively while maintaining protection
Solution Approach 2:
The composite system of silicone gel plus housing creates a protective structure that addresses both protection and thermal management needs, with the gel providing thermal pathways and the housing providing structural integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability and longevity of power module bridges by reducing mechanical stress and thermal fatigue, while also improving heat dissipation and protecting against environmental factors.
Implementation Method 1
a frame with lateral boundaries and with an upwardly and/or downwardly exposed region, wherein a volume enclosed by the frame is filled with a gel
Implementation Method 2
one or more circuit carriers, one or more semiconductor switches, one or more spacers and one or more connection boards are connected to one another via a sintered connection
Implementation Method 3
one or more circuit carriers which include at least three layers of material, wherein a middle circuit carrier layer includes an insulating material, a first outer circuit carrier layer and a second outer circuit carrier layer include an electrically conductive material
Data Source
AI summary
A power module bridge. The power module bridge includes: one or more power modules each including: one or more circuit carriers, one or more semiconductor switches, one or more connection boards, one or more flexible printed circuit boards, and. one or more spacers; a gate circuit board; a frame with lateral boundaries and with an upwardly and/or downwardly exposed region, wherein a volume enclosed by the frame is filled with a gel; and one or more connecting elements, wherein one or more circuit carriers, one or more semiconductor switches, one or more spacers, and one or more connection boards are connected to one another via a sintered connection.