Power Module Heat-Conducting Plate Integration
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Solution Overview
Problem
Miniaturized power modules face challenges in efficient heat dissipation due to the production of high heat by high power electronic components, leading to potential shutdowns of electronic equipment, and existing solutions complicate fabrication and increase costs.
Innovation Solution
Incorporating a heat-conducting plate directly into the housing during fabrication, made from the same metal plate as the pins, to enhance heat dissipation efficiency while simplifying the fabrication process and reducing material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is attached on high power electronic components to dissipate heat, then heat dissipation efficiency is improved, but device volume increases and fabrication complexity increases
Solution Approach 1:
The patent merges the heat-conducting plate with the housing into a single integrated structure. The housing serves dual functions as both structural enclosure and heat dissipation component, eliminating the need for separate heat sinks and reducing overall module volume while maintaining effective heat dissipation.
Solution Approach 2:
The housing is designed to perform multiple functions simultaneously: mechanical protection of internal components and thermal management through its heat-conducting properties. This multi-functionality reduces the number of separate components needed, thereby reducing volume and simplifying fabrication.
2Temperature
If a heat sink is attached on high power electronic components to dissipate heat, then heat dissipation efficiency is improved, but fabrication complexity and cost increase
Solution Approach 1:
The heat-conducting plate is integrated into the housing structure, reducing the number of separate components from two (housing + heat sink) to one (combined housing-heat-conducting plate). This integration simplifies the assembly process and reduces fabrication complexity while maintaining heat dissipation functionality.
Solution Approach 2:
The housing performs dual functions as structural enclosure and heat dissipation device, eliminating the need for separate heat sink assembly steps. This multi-functionality reduces fabrication complexity and potential assembly errors while lowering production costs.
3Ease of manufacture
If heat is dissipated only through conduction to circuit board or convection/radiation through housing, then fabrication is simple, but heat dissipation efficiency is insufficient for high power components
Solution Approach 1:
The patent combines direct thermal conduction through the heat-conducting plate to the housing with convective and radiative heat dissipation from the housing surfaces. This hybrid approach maintains fabrication simplicity while significantly improving heat dissipation efficiency compared to single-mode heat dissipation methods.
Solution Approach 2:
The heat-conducting plate acts as an intermediary thermal pathway between the high power electronic components and the housing. It efficiently conducts heat from the components to the housing, which then serves as a heat sink for convective and radiative dissipation, creating an effective multi-stage heat management system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively dissipates heat through conduction, radiation, and convection, improving the thermal management of miniaturized power modules and reducing the risk of equipment shutdown while lowering production costs.
Implementation Method 1
a heat-conducting plate is inlaid on the housing directly while forming the housing, so as to simplify the fabrication method, secure the heat-conducting plate firmly and raise the heat dissipating efficiency of the power module
Implementation Method 2
the heat cannot be dissipated efficiently from the housing and the accumulated heat may cause the shutdown of the electronic equipment
Implementation Method 3
the heat cannot be dissipated efficiently from the housing and the accumulated heat may cause the shutdown of the electronic equipment
Data Source
AI summary
A power module fabrication method and structure thereof is disclosed. The method includes steps of: providing a metal plate and defining a pattern on the metal plate; cutting the metal plate according to the pattern to form a plurality of pins and the heat-conducting plate, wherein the pin is coupled to each other or to the metal plate via a connection part and the heat-conducting plate is coupled to the connection part via a fixing part; bending a first end of the pin to form an extension part and bending the fixing part to dispose the heat-conducting plate and the metal plate at different levels; providing a circuit board with a plurality of via holes and inserting the extension part into the via hole correspondingly and fixing the pin on the circuit board; forming a housing to encapsulate the circuit board therein, wherein the heat-conducting plate is inlaid on the housing and a second end of the pin is extended out of the housing; and cutting the connection part and the fixing part to separate the pin from each other and from the metal plate and isolate the pin and the heat-conducting plate.