Power Electronic Module Layout for Heat Dissipation and High Current
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Solution Overview
Problem
Smart power stage components face challenges in achieving efficient system thermal management and enhanced electrical performance due to increased internal electronic module packing density, requiring improved heat dissipation and electrical resistance.
Innovation Solution
A power electronic module design featuring an electrical connection through an inductor component allowing a high current path from a top substrate to a bottom substrate, with a semiconductor component positioned on an external surface for thermal contact with a heat sink, reducing heat dissipation paths and electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If internal electronic module packing density is increased, then module compactness is improved, but thermal management efficiency deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by positioning the semiconductor component on the external surface of the top substrate, enabling heat to be dissipated in multiple spatial dimensions simultaneously, thus resolving the conflict between compactness and thermal management efficiency
Solution Approach 2:
The patent introduces a metallic spacer as a thermal intermediary between the semiconductor component and the heat sink, enhancing heat transfer efficiency from the compact module interior to the external cooling system, thereby maintaining thermal management efficiency despite increased packing density
2Reliability
If connector structure current load is reduced, then electrical performance is improved, but connector size must be minimized
Solution Approach 1:
The patent extracts the high current path function from the connector structure and relocates it to the inductor component body, which serves as an alternative current pathway. This reduces the current burden on connectors while maintaining electrical performance, allowing for minimized connector size in compact modules
3Temperature
If heat dissipation path is reduced, then thermal management is improved, but component placement constraints increase
Solution Approach 1:
The patent utilizes the external surface of the top substrate as a third-dimensional mounting location for the semiconductor component, creating a direct vertical heat dissipation path to the heat sink. This three-dimensional arrangement reduces heat dissipation path length while avoiding complex lateral routing constraints
Solution Approach 2:
The inductor component body serves dual functions: as an electrical component and as a self-contained current pathway. This self-service approach allows current to flow directly through the inductor body, reducing reliance on external connector structures and simplifying overall component placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances electrical resistance and thermal management by providing a compact footprint with reduced current load on connectors and efficient heat dissipation, enabling operation at various current and voltage levels.
Implementation Method 1
an electrical connection on opposing surfaces of an electronic component, e.g., an inductor, that allows a high current path from a top board (e.g., a second substrate) to a bottom board (e.g., a first substrate) through the body of the electronic component
Implementation Method 2
a semiconductor component, e.g., a smart power stage component, positioned on an external surface of the top board which allows for thermal contact of the semiconductor component with an external heat sink
Implementation Method 3
The purpose of the metallic spacer is to conduct the heat generated by the smart power stage components to a cooling device, such as a heat sink
Data Source
AI summary
A power electronic module is provided that includes an electrical connection on opposing surfaces of an electronic component that allows a high current path from a top board to a bottom board through the body of the electronic component thus improving the power electronic module's electrical resistance and reducing the current load on the connector structure which is located between the first substrate and the second substrate. The power electronic module further includes a semiconductor component positioned on an external surface of the top board which allows for thermal contact of the semiconductor component with an external heat sink thus providing an efficient system thermal management via a reduced heat dissipation path. Additional heat dissipation can be obtained by disposing a metallic spacer on the semiconductor component of the power electronic module of the present disclosure.