Power Semiconductor Module Layout for Double-Sided Heat Dissipation
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Solution Overview
Problem
Current power semiconductor modules face challenges in heat dissipation and power density due to inefficient cooling through the top side, which increases production costs and complexity, with limited thermal resistance reduction.
Innovation Solution
A semiconductor module design featuring two electrically insulating substrates with semiconductor devices mounted on one side and heat sinks on the opposite sides for improved heat dissipation, allowing for efficient cooling from both sides while maintaining low costs and process complexity using established assembly technologies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If double-sided cooling is implemented with heat dissipation plates on both sides of semiconductor devices, then heat dissipation efficiency is improved, but production cost and process complexity increase significantly
Solution Approach 1:
The module is divided into two independent substrate assemblies, each with semiconductor devices mounted on one side and heat sinks on the other. The substrates are arranged with their device-facing sides opposite each other, creating two separate but complementary cooling paths. This segmentation allows each side to be manufactured and assembled independently using conventional processes, avoiding the complexity of true double-sided cooling while achieving similar thermal performance.
Solution Approach 2:
Instead of mounting heat sinks directly on both sides of the semiconductor devices (conventional double-sided cooling), the patent inverts the approach by mounting devices on both sides of the substrates and placing heat sinks on the opposite sides. This inversion allows the use of standard single-sided device mounting processes while achieving dual-sided heat dissipation through the substrate arrangement.
2Temperature
If cooling plates are attached to the top side of semiconductor devices for heat removal, then thermal resistance is reduced, but electrical connection reliability is compromised due to potential damage to electrical connections
Solution Approach 1:
The patent extracts the cooling function from the device top surface by placing heat sinks on the bottom sides of the substrates, opposite the semiconductor devices. This separation allows the top surfaces to be dedicated entirely to electrical connections without the risk of cooling plate attachment damage, while heat dissipation occurs through the substrate to the heat sinks on the opposite side.
Solution Approach 2:
The substrates serve as intermediary elements between the semiconductor devices and the heat sinks. Heat is conducted through the substrate material from the device mounting surface to the heat sink mounting surface on the opposite side, providing a reliable thermal path that does not require direct attachment of cooling plates to the device top surface, thus protecting electrical connections.
3Temperature
If spacer is mounted across the entire top side of semiconductor device for height adjustment, then heat dissipation through top side is improved, but manufacturing precision requirements increase due to need to avoid damaging electrical connections
Solution Approach 1:
Instead of mounting spacers on the top side of devices to achieve height adjustment and heat dissipation, the patent inverts the approach by mounting heat sinks on the bottom sides of the substrates. This eliminates the need for precision spacer mounting on device top surfaces, as the height adjustment and thermal management are achieved through the substrate and heat sink assembly on the opposite side.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation and power density by exposing second main surfaces of substrates for increased cooling area, reducing thermal resistance, and integrating heat sinks for efficient heat removal, while maintaining low manufacturing costs and complexity.
Implementation Method 1
the substrates are arranged opposite to each other so that their first main surfaces are facing each other... efficient cooling from both sides... reducing thermal resistance
Implementation Method 2
heat sinks on the opposite sides for improved heat dissipation... integrating heat sinks for efficient heat removal
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3a~3b
AI summary
The present invention relates to a semiconductor module, especially a power semiconductor module, in which the heat dissipation is improved and the power density is increased. The semiconductor module (100) comprises at least two electrically insulating substrates (101a, 101b), each having a first main surface (102a, 102b) and a second main surface (103a, 103b) opposite to the first main surface. On the first main surface of each of the substrates, at least one semiconductor device (110) is mounted. An external terminal (120) is connected to the first main surface of at least one of the substrates. The substrates are arranged opposite to each other so that their first main surfaces are facing each other.