Power Module Heat Dissipation via 3D Conductive Laminate
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Solution Overview
Problem
Power modules with embedded transformer coils often face challenges in heat dissipation due to restrictive laminate members, which can lead to functional and structural integrity issues from excessive heat.
Innovation Solution
A power module design featuring a laminate member with vertically aligned transformer coils, thermally conductive members extending in three dimensions, and integrated EMI shield coils that enhance heat dissipation by transferring heat from transformer coils to the laminate member's surface through thermally conductive components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If transformer coils are embedded within a laminate member, then the structural integrity and electrical isolation are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by extending thermally conductive members vertically through the laminate member thickness. This dimensional change allows heat to be conducted from the embedded transformer coils through multiple layers of the laminate to external heat sinks, effectively addressing the heat dissipation problem while maintaining the structural benefits of embedding.
Solution Approach 2:
The patent introduces thermally conductive members as intermediary elements between the transformer coils and the laminate member surfaces. These members act as thermal bridges that facilitate heat transfer from the coils through the laminate structure to external heat dissipation components, resolving the contradiction between structural integrity and heat dissipation.
2Object-generated harmful factors
If transformer coils are embedded within a laminate member, then electromagnetic shielding is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent makes the laminate member multi-functional by integrating both EMI shielding and heat dissipation capabilities into a single structure. The laminate member simultaneously provides electromagnetic shielding through its composition and structure, while also serving as a thermal conduction pathway through the embedded thermally conductive members, thus addressing both EMI and heat dissipation requirements.
Solution Approach 2:
The patent combines the EMI shielding function and heat dissipation function into a unified laminate member structure. By embedding thermally conductive members within the EMI-shielding laminate, the design merges two previously separate functions (shielding and cooling) into a single integrated component, eliminating the need for separate shielding and thermal management systems.
3Temperature
If thermally conductive members extend vertically through the laminate member, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent segments the thermal management system into distinct functional zones: thermally conductive members for heat conduction, adhesive layers for bonding, and external heat sink components for heat dissipation. This segmentation allows each component to be optimized independently and simplifies the overall design by breaking down the complex heat dissipation challenge into manageable segments.
Solution Approach 2:
The patent resolves the complexity issue by utilizing the vertical dimension for heat conduction while keeping the horizontal footprint compact. The thermally conductive members extend in the thickness direction of the laminate, allowing efficient heat transfer without increasing the planar area or requiring complex lateral heat dissipation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat away from the transformer coils, improving the thermal integrity and operational efficiency of power modules by optimizing the positioning and configuration of thermally conductive members and EMI shield coils.
Implementation Method 1
thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member
Implementation Method 2
an electromagnetic interference (EMI) shield coil
Data Source
AI summary
In some examples, an electronic device comprises a first magnetic member, a first adhesive layer abutting the first magnetic member, a second magnetic member, a second adhesive layer abutting the second magnetic member, and a laminate member between the first and second adhesive layers. The laminate member comprises first and second transformer coils, an electromagnetic interference (EMI) shield coil, and a set of thermally conductive members coupled to the EMI shield coil and extending in three dimensions. At least some of the thermally conductive members extend vertically through a thickness of the laminate member so as to be exposed to top and bottom surfaces of the laminate member. The electronic device includes a thermally conductive component coupled to at least one thermally conductive member in the set of thermally conductive members.