Power Module Heat Dissipation Structure for OAM Height Limits
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Solution Overview
Problem
Traditional high-power chip power supply modules in OAM-VPD configurations face challenges in heat dissipation due to limited space, leading to increased thermal resistance and elevated XPU temperatures, which impair processing capabilities.
Innovation Solution
A heat dissipation structure is implemented where the heating power component in the power supply module is positioned away from the pin surface, with an additional heat dissipation channel provided. This structure utilizes a combination of transverse and longitudinal thermal conductors, along with a vapor chamber, to effectively conduct heat to a top heat dissipation device, enhancing both heat transfer and mechanical fastening.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power supply module is arranged in a vertical configuration (OAM-VPD) to increase power supply current capacity, then the power supply capability is improved, but the heat dissipation space is reduced due to limited height between the OAM card and system motherboard
Solution Approach 1:
The patent transitions from traditional horizontal power supply arrangement to vertical power supply configuration, changing the spatial dimension of power delivery. The power supply module is positioned vertically beneath the XPU, utilizing the vertical dimension to achieve higher current capacity while managing heat dissipation through specialized thermal conduction paths rather than relying on horizontal space.
Solution Approach 2:
The patent introduces a heat dissipation device as an intermediary component between the power supply module and the XPU. This device includes thermal conduction components that transfer heat from the power supply module through the motherboard to the XPU heat sink, effectively mediating the thermal management in the constrained vertical space.
2Temperature
If the heat dissipation device thickness is increased to improve heat dissipation performance, then the heat dissipation capability is improved, but the total height of the OAM card increases, exceeding the limited height constraint
Solution Approach 1:
The heat dissipation system is segmented into multiple functional components: a power supply module with its own heat dissipation structure, a motherboard with thermal conduction pathways, and a separate XPU heat sink. This segmentation allows each component to be optimized independently for thermal performance without proportionally increasing the overall card height.
Solution Approach 2:
The patent employs thin-film heat dissipation structures and flexible thermal interface materials that provide effective thermal conduction while occupying minimal vertical space. These thin thermal management layers enable adequate heat dissipation performance without significantly increasing the OAM card's total height.
3Device complexity
If the high-frequency power semiconductor is arranged on the face close to the intelligent card motherboard to simplify the structure, then the structural complexity is reduced, but the heat transfer path becomes longer and thermal resistance increases
Solution Approach 1:
The patent merges the power supply module with the motherboard structure, integrating thermal conduction pathways directly into the motherboard design. The heat dissipation device is combined with the power supply module assembly, creating a unified thermal management system that reduces thermal resistance while maintaining structural simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively prevents heat from the power supply module from interfering with the XPU's operation, achieves improved heat dissipation in limited height spaces, and maintains the processing capability of the XPU by reducing thermal resistance.
Implementation Method 1
the vapor chamber is thermally connected to the heat dissipation surface, and the vapor chamber is thermally connected to the top heat dissipation device by means of the longitudinal thermal conductor
Implementation Method 2
the longitudinal thermal conductor comprises a limiting end, a cylindrical heat pipe and a fastening structure; the limiting end and the fastening structure are arranged at the two ends of the cylindrical heat pipe respectively
Implementation Method 3
the cylindrical heat pipe penetrates through the first motherboard and the vapor chamber
Data Source
AI summary
A heat dissipation structure of a high-power chip power supply module is provided. The heat dissipation structure comprises a first motherboard, a second motherboard, a high-power chip module, a power supply module and a top heat dissipation device. The power supply module comprises at least one heating power component. The power supply module is provided with a heat dissipation surface. The heating power component is arranged adjacent to the heat dissipation surface. The heat dissipation structure further comprises a vapor chamber and a longitudinal thermal conductor. The vapor chamber is in thermal conduction with the heat dissipation face, and the vapor chamber is in thermal conduction with the top heat dissipation device through the longitudinal thermal conductor.