Power Module Housing Layout for Control Board Heat Isolation
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Solution Overview
Problem
Power electronic components and modules generate significant heat during operation, which can lead to increased temperatures in adjacent electronic components and control boards, reducing their reliability and potentially causing malfunctions.
Innovation Solution
Incorporating thermally insulating materials above the power electronic semiconductor chips and within the housing of the power electronic component to limit heat transfer to other electronic components, thereby preventing excessive heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat transfer path is designed to be effective for transferring heat to heatsink, then heat transfer efficiency is improved, but temperature of control board increases
Solution Approach 1:
The housing is divided into a first housing part and a second housing part, with the first housing part serving as a thermal bridge to conduct heat away from the semiconductor chip, while the second housing part provides thermal insulation to protect the control board from heat. This segmentation allows the housing to simultaneously achieve effective heat transfer to the heatsink while protecting temperature-sensitive components.
Solution Approach 2:
The housing acts as an intermediary thermal management component between the heat-generating semiconductor chip and the temperature-sensitive control board. By designing the housing with specific thermal conductivity characteristics in different regions, it mediates the heat flow to achieve both efficient heat dissipation and thermal protection of sensitive components.
2Device complexity
If power electronic semiconductor chips are placed in close vicinity to improve integration, then device integration is improved, but heat damage to other components increases
Solution Approach 1:
The housing exhibits local quality variations in thermal conductivity, with the first housing part having higher thermal conductivity to conduct heat away from the chip, and the second housing part having lower thermal conductivity to insulate the control board. This local differentiation allows close integration of components while protecting sensitive areas from heat damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of thermally insulating materials effectively restricts heat transfer from the power electronic semiconductor chips to other components, reducing the risk of overheating and enhancing the reliability of adjacent electronic components and control boards.
Implementation Method 1
a thermal insulator (21) which increases a thermal resistance from the power electronic semiconductor chip (3) towards a top of the power electronic component
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
A power electronic component comprising a surface adapted to be attached to a heatsink, the surface forming a bottom surface of the power electronic component, one or more power electronic semiconductor chips (3) mounted on a substrate (4) above the bottom surface, and a housing (2) enclosing the one or more power electronic semiconductor chips. The power electronic component comprises a thermal insulator (21; 31; 41; 51) disposed above the one or more power electronic semiconductor chips, such that the bottom surface and the thermal insulator (21; 31; 41; 51) are on the opposite sides of the one or more power electronic semiconductor chips (3).