Power Module Assembly Structure With Protruding-Step Heat Path
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Solution Overview
Problem
Traditional power module assembly structures face challenges in heat dissipation due to limited heat exchange areas and poor thermal conductivity of the tin layer, leading to inefficient heat dissipation despite the use of liquid-cooling methods.
Innovation Solution
Incorporating cooling protruding-steps made of high-thermal-conductivity materials on the fin base to replace part of the tin layer, forming an optimized heat dissipation path while maintaining bonding strength, with the protruding steps aligned with semiconductor elements and having a smaller height than the original tin layer thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a tin layer is used to weld the power module and the heat dissipation fin, then the bonding strength is sufficient, but the thermal conductivity is poor resulting in inadequate heat dissipation
Solution Approach 1:
The tin layer is segmented into two distinct regions: a first tin layer region providing bonding function between the substrate and fin base, and a second tin layer region (protruding step) providing thermal conduction function. This segmentation allows each region to be optimized for its specific function, resolving the contradiction between bonding strength and thermal conductivity.
Solution Approach 2:
Different regions of the tin layer are given different properties: the first tin layer region has sufficient thickness for bonding strength, while the second tin layer region forms protruding steps with smaller thickness optimized for thermal conduction. This local differentiation of properties allows the structure to simultaneously achieve both bonding strength and heat dissipation efficiency.
2Loss of energy
If the tin layer thickness is reduced to improve heat dissipation, then the thermal resistance decreases, but the bonding strength is compromised
Solution Approach 1:
The tin layer is divided into two functional segments: the first tin layer region maintains sufficient thickness for bonding strength, while the second tin layer region (protruding steps) has reduced thickness for lower thermal resistance. This segmentation enables simultaneous optimization of both bonding strength and heat dissipation.
Solution Approach 2:
The tin layer exhibits local quality variations with different thicknesses in different regions. The first tin layer region has greater thickness for bonding, while the second tin layer region has smaller thickness for thermal conduction, allowing local optimization of both strength and heat dissipation properties.
3Device complexity
If traditional aluminum extrusion or die-cast heat dissipation fins are used, then the structure is simple, but the heat exchange area is limited resulting in insufficient heat dissipation
Solution Approach 1:
The protruding steps extend vertically from the fin base surface, adding a dimensional element that increases the heat exchange area without significantly complicating the overall structure. This dimensional addition allows the heat dissipation surface to engage more effectively with the cooling medium.
Solution Approach 2:
The fin base with protruding steps creates a porous-like surface structure that increases the effective heat exchange area. The protruding steps provide additional surfaces for heat transfer, similar to how porous materials increase surface area, thereby improving heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces thermal resistance and enhances overall heat dissipation efficiency by improving the heat transfer path and bonding surface area without compromising structural integrity.
Implementation Method 1
the base further includes a protruding step disposed on the first surface of the base... replace a part of the tin layer with the high-thermal-conductivity material of the fin base... the thermal resistance is reduced effectively
Data Source
AI summary
A power module assembly structure is disclosed and includes a substrate, a semiconductor element, a base, a plurality of heat dissipation fins and a tin layer. The substrate includes a first metal surface and a second metal surface spatially opposite to each other. The semiconductor element is disposed on the first metal surface. The base includes a first surface and a second surface spatially opposite to each other. The plurality of heat dissipation fins are disposed on the second surface of the base. The tin layer is disposed between the second metal surface and the first surface of the base, so that the first surface of the base is close to the second metal surface. The base further includes a protruding step disposed on the first surface of the base, and the protruding step has a center aligned with the semiconductor element.