Power Module Cooling With Passive-Active Heat Paths to Cut Leaks
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Solution Overview
Problem
Existing automotive cooling systems for power switches rely heavily on active heat sinks with coolant flow, which can lead to coolant leaks and increased production and maintenance costs.
Innovation Solution
A combination of passive and active cooling systems is implemented, where a passive heat dissipation element with a thermo-conductive plate is in thermal contact with an active heat dissipation element, reducing the need for multiple active heat sinks and minimizing coolant leaks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple active heat sinks with coolant flow are used to dissipate heat from power switches, then heat dissipation effectiveness is improved, but the risk of coolant leaks and production costs increase
Solution Approach 1:
The patent combines passive heat dissipation elements with a single active heat dissipation element into an integrated cooling system. The passive elements (heat sinks, thermal vias, spreaders) work together with one active heat sink containing coolant channels, reducing the number of separate active cooling components while maintaining effective heat dissipation and minimizing coolant leak risks
2Temperature
If multiple active heat sinks with coolant flow are used to dissipate heat from power switches, then heat dissipation effectiveness is improved, but production and maintenance costs increase
Solution Approach 1:
The patent merges multiple heat dissipation functions into a single integrated system where passive thermal management components (heat sinks, thermal vias, spreaders) cooperate with one active heat sink. This consolidation reduces manufacturing complexity, material requirements, and maintenance needs compared to using multiple separate active heat sinks
Solution Approach 2:
The passive heat dissipation elements perform thermal management functions automatically without requiring additional active components. The passive heat sinks, thermal vias, and spreaders conduct and distribute heat naturally through thermal conduction, reducing dependence on multiple active cooling systems and their associated costs
3Ease of manufacture
If a passive heat dissipation element is shaped to be enclosure-free with surfaces terminating in free space, then manufacturing complexity is reduced, but thermal contact efficiency must be optimized
Solution Approach 1:
The passive heat dissipation element features localized planar contact surfaces specifically designed for optimal thermal contact with the active heat sink and power switches. These flat surfaces are positioned at critical thermal interface locations, ensuring efficient heat transfer while the rest of the structure remains simple and enclosure-free for ease of manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively dissipates heat from power switches, reduces the risk of coolant leaks, and decreases production and maintenance costs by utilizing a single active heat sink and a passive heat dissipation element.
Implementation Method 1
a passive heat dissipation element in contact with and facing a first surface of the one or more power switches... in thermal contact with the active heat dissipation element
Implementation Method 2
Heat sinks provide effective means of dissipating heat by thermally conducting heat into a fluid medium
Data Source
AI summary
A power module, includes: one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.