Power Module Package Layout for Heat and Signal Isolation
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Solution Overview
Problem
Existing power modules in electronic products, such as in-vehicle inverters, have low integration and intelligence, leading to long latency, signal interference, and reliability issues due to separate power and signal components connected via metal wire bonding, which results in heat dissipation challenges and increased risk of wire sagging and short-circuits.
Innovation Solution
A packaged structure integrating power units on one substrate and a control unit on another, connected via conductive bridges and flexible printed circuit boards, reduces thermal interference and allows for efficient heat dissipation, while eliminating wire bonding risks through a stable and low-resistance connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power modules include only power chip parts with external connections, then integration is low, but manufacturing and maintenance are simpler
Solution Approach 1:
The patent merges power chip parts and control circuit parts into a single integrated power module. The power chip parts include power transistors and diodes, while the control circuit parts include drive circuits and protection circuits. These are integrated on the same substrate with optimized layout to achieve high integration while maintaining reliability through reduced external connections and improved signal integrity.
2Device complexity
If power chip parts are externally connected to integrated circuits, then integration is low, but signal interference is reduced
Solution Approach 1:
The patent segments the power module into distinct functional regions: power chip parts region and control circuit parts region. This segmentation is achieved through separate substrate areas with dedicated connection paths. The control circuit parts include drive circuits and protection circuits that are spatially separated from power devices, reducing electromagnetic interference while maintaining functional integration.
Solution Approach 2:
The patent introduces a substrate as an intermediary between power chip parts and control circuit parts. This substrate serves as a common platform that provides electrical connections while isolating the two functional areas. The substrate includes trace routing that minimizes parasitic inductance and capacitance, acting as a mediator that enables integration without excessive signal interference.
3Reliability
If power modules are integrated with control circuits, then reliability improves, but heat dissipation becomes more challenging
Solution Approach 1:
The patent applies local quality by providing dedicated heat dissipation structures for power chip parts while keeping control circuit parts thermally isolated. The substrate includes thermal vias and heat sinks positioned under power devices, with different thermal management characteristics in different regions. This allows efficient heat dissipation from high-power areas without exposing sensitive control circuits to excessive heat.
4Adaptability or versatility
If many chips are integrated into the power module, then functionality increases, but wire bonding risks increase
Solution Approach 1:
The patent replaces traditional wire bonding mechanical connections with direct solder connections or conductive paste connections between chip pads and substrate traces. This substitution eliminates the mechanical wire bonding process entirely, using instead a more reliable metallurgical bonding method that is better suited for high-temperature power module operation and reduces the risk of wire sagging and sweep-related short circuits.
Data Source
AI summary
A packaged structure includes a first substrate and a second substrate. Power units are disposed on a first surface of the first substrate. A control unit is disposed on a first surface of the second substrate, and the second substrate is connected to one end of the first substrate. The control unit is electrically connected to the power units. The control unit is configured to: receive an external input signal, collect an internal sensing signal, and control the power units to work. The first surface of the second substrate is disposed on a same side as the first surface of the first substrate. When the structure is used, a signal part and a power part are integrated. The power units are disposed on the first substrate, and the control unit is disposed on the second substrate, so that the signal part and the power part can be separately disposed.