Power Module Heat Sink Layout for Compact Low-Inductance Cooling
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Solution Overview
Problem
Existing power electronic systems face challenges in efficiently dissipating heat and optimizing size and mass, particularly in applications requiring low mass and small size, such as on-board power converters.
Innovation Solution
The system comprises parallel power modules with optimized external connections, utilizing conductive and capacitive lateral connections between heat sinks to form switching cells, allowing for efficient cooling and simplified design, and incorporating control boards for coolant channeling and electromagnetic compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of stationary object
If power modules are assembled in a compact stack with interposed heat sinks, then cooling efficiency is improved and mass/size is reduced, but device complexity increases due to optimized external connections
Solution Approach 1:
The patent merges the cooling function and electrical connection function into a single integrated structure. The heat sinks serve dual purposes: they dissipate heat from power components and provide electrical connections between modules. This merging eliminates the need for separate cooling plates and connection terminals, reducing overall system mass and complexity while maintaining effective cooling and electrical connectivity.
2Volume of stationary object
If power modules are assembled in a compact stack with interposed heat sinks, then cooling efficiency is improved and mass/size is reduced, but device complexity increases due to optimized external connections
Solution Approach 1:
The patent merges the cooling function and electrical connection function into a single integrated structure. The heat sinks serve dual purposes: they dissipate heat from power components and provide electrical connections between modules. This merging eliminates the need for separate cooling plates and connection terminals, reducing overall system mass and complexity while maintaining effective cooling and electrical connectivity.
3Device complexity
If conventional power module assembly is used, then device complexity is lower, but cooling efficiency decreases and mass/size increases
Solution Approach 1:
The heat sinks are designed to automatically serve multiple functions without additional components. The same heat sink structure that dissipates heat also provides electrical connectivity between modules. This self-service approach allows the cooling system to simultaneously perform electrical connection duties, eliminating the need for separate connection mechanisms and reducing overall system complexity while improving heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces system mass and size while enhancing cooling efficiency, minimizing pressure losses and parasitic inductance, and facilitating the creation of compact, modular power electronic systems suitable for on-board applications.
Implementation Method 1
Each elementary power module comprises power components, such as transistors (e.g., Insulated Gate Bipolar Transistors (IGBTs)) and diodes, assembled in the form of a chip to perform an elementary function, for example, an electronic switch function. The heat produced by the power components of the elementary power modules must be dissipated.
Implementation Method 2
connected to each other by a conductive lateral electrical connection between the first and second phase dissipators, and by a capacitive lateral electrical connection between the anode and cathode dissipators
Data Source
Figure 1~2
Figure 3~4
Figure 5A~5D
AI summary
The invention relates to a power electronics system comprising a plurality of power components (XOOA, YOOA) and a plurality of electrically conductive heat sinks (X1, X2, Y1, Y2, U1, U2, V1, V2, A1, A2, B1, B2, I1, I2, J1, J2), each of the power components (XOOA) being arranged between two electrically conductive heat sinks (X1, X2) of the plurality of electrically conductive heat sinks, at least one electrically conductive heat sink being configured to be biased to a phase potential, referred to as the phase heat sink (X2, Y2, U2, V2, A2, B2, I2, J2), at least one electrically conductive heat sink being configured to be biased to a -DC potential, referred to as the cathode heat sink (Y1, V1, B1, J1), and at least one electrically conductive heat sink being configured to be biased to a -DC potential, referred to as the anode heat sink (X1, U1, A1, I1), the system being characterised in that it further comprises at least one external phase connection (200, 201, 202), and at least one external +DC connection (100, 101), and at least one external -DC connection (100, 102) respectively connected to the phase heat sink, to the cathode heat sink and to the anode heat sink.