Power Module Insulation Plate Layout for Heat Sink Isolation
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Solution Overview
Problem
Conventional power modules require electrical insulation of the heat dissipation surface of housed power semiconductors before they can be connected to a heat sink, leading to complex and costly structures.
Innovation Solution
A power module design featuring housed power semiconductors with non-electrically insulated heat dissipation surfaces, connected to a heat sink via insulation plates that provide both thermal and electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the heat dissipation surface of housed power semiconductors is electrically insulated before connection to heat sink, then electrical insulation is achieved, but the structure becomes complex and costly
Solution Approach 1:
An insulation plate is introduced as an intermediary component between the housed power semiconductor and the heat sink. This plate provides the necessary electrical insulation while maintaining thermal coupling, thereby avoiding the need for complex internal insulation structures within the power semiconductor housing itself.
Solution Approach 2:
The insulation function is separated from the power semiconductor housing and assigned to a dedicated insulation plate component. This segmentation allows the power semiconductor to focus on its primary function while the insulation plate handles electrical isolation, simplifying the overall structure.
2Reliability
If the heat dissipation surface of housed power semiconductors is electrically insulated before connection to heat sink, then electrical insulation is achieved, but manufacturing costs increase
Solution Approach 1:
The insulation plate serves as a cost-effective intermediary that provides electrical insulation through a simple, standardized component rather than requiring expensive custom insulation integration into each power semiconductor unit.
Solution Approach 2:
The insulation plate is a universal component that can be used with multiple housed power semiconductors, reducing per-unit manufacturing costs compared to custom insulation solutions for each semiconductor device.
3Temperature
If insulation plates are arranged between housed power semiconductors and heat sink, then thermal connection is optimized while electrical insulation is maintained, but the number of components increases
Solution Approach 1:
The insulation plate acts as a dual-function mediator that simultaneously improves thermal connection through its thermal conductive properties while maintaining electrical insulation, thereby justifying the additional component through its multiple benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves an optimal thermal connection while maintaining electrical insulation, simplifying the structure and potentially reducing costs compared to conventional methods.
Implementation Method 1
One insulation plate in each case is connected with one side to a respective electrically non-insulated heat dissipation surface of a housed power semiconductor in a form-fitting manner and is connected with the other side to the heat sink in a form-fitting manner
Implementation Method 2
the insulation plates are arranged between the housed power semiconductors and a cooling surface of the heat sink
Data Source
AI summary
A power module for the controllable electrical power supply of a consumer includes a plurality of housed power semiconductors each with an electrically non-insulated heat discharge surface, a printed circuit board, a heat sink, one or more insulation plates, wherein the printed circuit board is arranged on a side of the power semiconductor in an orthogonal direction opposite the heat sink, wherein the insulation plate is arranged between the housed power semiconductors and a cooling surface of the heat sink, wherein one insulation plate in each case is interlockingly connected by one side to one electrically non-insulated heat discharge surface of a housed power semiconductor and is interlockingly connected by the other side to the heat sink.