Power Module Heat Spreader Layout for Compact Thermal Dissipation
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Solution Overview
Problem
Existing power modules face challenges in high-power density applications due to inadequate heat dissipation, particularly in space-constrained environments, where air and molding compounds with low thermal conductivity hinder effective heat removal from integrated circuits.
Innovation Solution
The implementation of multiple heat spreaders on both surfaces of the substrate, with one heat spreader inserted between the inductor assembly and power ICs, and another covering the power ICs, utilizing thermal interface material for enhanced heat dissipation, reducing overlap in heat flow paths and providing an even surface for external heat sinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If power modules are made smaller with vertical component layout to improve integration, then device size is reduced, but heat dissipation capability deteriorates due to space constraints and low thermal conductivity of surrounding materials
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat spreaders (first heat spreader, second heat spreader, third heat spreader) that are distributed across different surfaces of the substrate. Each heat spreader independently manages heat from specific power ICs, allowing efficient heat removal without requiring large component distances or compromising module compactness.
Solution Approach 2:
Heat dissipation is extended from a single-plane approach to a three-dimensional multi-surface approach. Heat spreaders are mounted on both the first surface and second surface of the substrate, utilizing the vertical dimension and multiple surfaces to create multiple heat dissipation pathways, thereby improving thermal performance without increasing the horizontal footprint of the power module.
2Temperature
If heat spreaders are added to improve heat dissipation, then thermal performance is enhanced, but device complexity increases due to additional components and assembly steps
Solution Approach 1:
The heat dissipation function is segmented across multiple heat spreaders positioned at different locations and orientations. The first heat spreader is mounted on the first surface, the second heat spreader is inserted between the inductor assembly and substrate, and the third heat spreader is mounted on the second surface. This segmentation allows each heat spreader to target specific heat sources efficiently while maintaining overall system manageability.
Solution Approach 2:
The heat spreaders serve multiple functions simultaneously: they conduct heat away from power ICs, provide thermal pathways through the substrate, and work collectively to dissipate heat from multiple surfaces. This multi-functionality reduces the need for additional specialized cooling components, thereby managing complexity while enhancing thermal performance.
3Volume of moving object
If inductor assembly is placed directly over power ICs to save space, then integration density is improved, but heat flow paths overlap causing thermal interference
Solution Approach 1:
The second heat spreader is inserted vertically between the inductor assembly and the substrate, creating a thermal interface layer that provides a dedicated heat conduction pathway. This vertical insertion allows heat to flow directly from power ICs through the second heat spreader to the substrate, bypassing the inductor assembly and preventing heat flow path overlap while maintaining the space-efficient vertical layout.
Solution Approach 2:
The second heat spreader acts as a thermal intermediary between the power ICs and the substrate. It provides a low thermal resistance pathway for heat to travel from the heat-generating power ICs directly to the substrate for dissipation, preventing heat from having to pass through the inductor assembly and eliminating thermal interference between the inductor and power ICs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves thermal performance by redistributing heat flow, reducing thermal resistance, and ensuring efficient heat dissipation from power ICs without passing through the inductor assembly, thereby enhancing the overall heat dissipation capability of the power module.
Implementation Method 1
the first insertion portion is in contact with the second heat spreader through a thermal interface material (TIM)
Data Source
AI summary
A power module has a substrate, and an inductor assembly, a first plurality of power integrated circuits (ICs), a first and second heat spreaders which are all mounted on a first surface of the substrate. The inductor assembly has a main body with a bottom surface facing the first surface of the substrate surface. The first plurality of power ICs are under the main body of the inductor assembly. A distance between the bottom surface of the main body of the inductor assembly and the first surface of the substrate is larger than heights of the first plurality of power ICs. The first heat spreader has a first insertion portion inserted between the main body of the inductor assembly and the first plurality of power ICs, and the first insertion portion is in contact with the second heat spreader through a thermal interface material (TIM).