A heat dissipation substrate for a power semiconductor module and a converter including the same
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Solution Overview
Problem
Conventional heat dissipation substrates for power semiconductor modules face issues with reduced heat dissipation performance and reliability due to high temperatures, leading to thermal runaway and potential module destruction, especially in high voltage and high current environments, which can compromise safety in vehicles.
Innovation Solution
A heat dissipation substrate design featuring an insulating substrate with fillers and metal plates, where fillers are disposed within the substrate to enhance heat transfer and bonding, and a pin-fin structure to improve thermal conductivity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional heat dissipation substrates (DBC or AMB method) are used, then the structure is simple and manufacturing is easy, but heat dissipation performance deteriorates at high temperatures (150°C or higher) leading to thermal runaway
Solution Approach 1:
The patent uses a composite substrate structure combining ceramic layer, metal layer, and glass layer. This composite material approach enables the substrate to maintain structural integrity and heat dissipation performance at high temperatures (150°C or higher) while preventing thermal runaway, thereby resolving the contradiction between reliability and device complexity.
Solution Approach 2:
The patent changes the physical and chemical parameters of the substrate materials and their interfaces to optimize heat dissipation. By controlling the composition and structure of the ceramic-metal-glass composite system, the substrate achieves stable thermal performance at elevated temperatures without compromising structural simplicity.
2Reliability
If bonding strength between metal plate and insulating substrate is insufficient, then manufacturing is easier, but peeling occurs at high temperatures reducing reliability
Solution Approach 1:
The patent employs a composite structure with ceramic layer, metal layer, and glass layer that are inherently bonded together. This composite design provides strong interlayer bonding that prevents peeling at high temperatures while maintaining manufacturing feasibility through established ceramic-metal bonding techniques.
Solution Approach 2:
The patent applies different materials and bonding methods to different regions and interfaces of the substrate. The ceramic-metal interface and metal-glass interface use optimized local compositions and bonding processes to achieve superior bonding strength at each interface, preventing peeling under thermal stress.
3Reliability
If heat transfer area is small and heat transfer path is long, then device structure is simpler, but heat dissipation performance is insufficient leading to thermal runaway
Solution Approach 1:
The patent extends the heat transfer path from one-dimensional through-thickness conduction to multi-dimensional heat dissipation by incorporating lateral heat spread in the metal layer and optimized ceramic structure. This dimensional expansion increases effective heat transfer area and shortens thermal resistance without significantly complicating the overall device structure.
Solution Approach 2:
The composite ceramic-metal-glass structure provides multiple heat transfer pathways with different thermal conductivities. The metal layer offers high thermal conductivity paths, while the ceramic layer provides structural support and additional heat dissipation routes, collectively enhancing heat dissipation performance without excessive structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation performance by increasing the heat transfer area and shortening the heat transfer path, while improving bonding strength and reliability by dispersing external stress and preventing peeling, thus preventing thermal runaway and module destruction.
Implementation Method 1
The filler may be in contact with the lower surface of the first metal plate, thereby improving heat dissipation performance
Implementation Method 2
a pin-fin structure to improve thermal conductivity and reliability
Implementation Method 3
a bonding metal layer and a diffusion metal layer disposed between the first metal plate (221) and the insulating substrate (210)
Data Source
Figure 1~2
Figure 3~4
Figure 5~6A
AI summary
A heat dissipation substrate for a power semiconductor module according to an embodiment can include an insulating substrate; a first metal plate disposed on the insulating substrate; a second metal plate disposed under the insulating substrate; and a filler disposed within the insulating substrate. The filler may be in contact with a lower surface of the first metal plate.